| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Accuracy | ±0.01mm |
|---|---|
| Control System | PLC |
| Dimensions | L 1000mm X W 500mm X H 800mm |
| Forming Method | Mechanical |
| Material | Stainless Steel |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC |
| Injection Pressure | 2000 Bar |
| Product Type | Molding Equipment |
|---|---|
| Precision | High |
| Pressure Control | Precision Pressure Control |
| Control System | PLC |
| Cycle Time | Short |
| Air Consumption | 0.2m³/min |
|---|---|
| Air Pressure | 0.5-0.8MPa |
| Control System | PLC |
| Dimensions | 1200mm*800mm*1600mm |
| Forming Accuracy | ±0.2mm |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC Control |
| Injection Speed | 1000 Mm/s |
