Automatic Semiconductor Packaging Equipment With Water Cooling System
| Platen Size: | 600 X 600 Mm |
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| Clamping Force: | 1000 KN |
| Max. Mold Height: | 400 Mm |
| Platen Size: | 600 X 600 Mm |
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| Clamping Force: | 1000 KN |
| Max. Mold Height: | 400 Mm |
| Control System: | PLC |
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| Temperature Control: | Precision Temperature Control |
| Product Type: | Molding Equipment |
| Control System: | PLC |
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| Dimensions: | 1200mm X 800mm X 1500mm |
| Frequency: | 50Hz |
| Power Consumption: | 2.5kW |
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| Sorting Accuracy: | 99.9% |
| Sorting Size Range: | 1mm - 20mm |
| Application: | Integrated Circuit (IC) Lead Frame Stamping |
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| Material: | Steel |
| Mold Hardness: | HRC 50-60 |
| Material: | High-quality Steel |
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| Mold Life: | 500,000 Shots Or More |
| Mold Base: | LKM, DME, HASCO Or Customized |
| Capacity: | 200 Tons |
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| Clamping Force: | 2000 KN |
| Ejector Force: | 50 KN |
| Active Ingredient: | Sodium Hypochlorite |
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| Application Method: | Spray |
| Country Of Origin: | United States |
| Capacity: | 100 Tons |
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| Clamping Force: | 150 Tons |
| Control System: | PLC |
| Application: | Semiconductor Manufacturing |
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| Capacity: | 1000 Tons |
| Control System: | PLC |
| Name: | Trim And Form Machine |
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| Forming Method: | Pneumatic Press |
| Operating Interface: | Touch Screen |
| Control System: | PLC Control |
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| Dimensions: | 1500mm*1000mm*1200mm |
| Power Supply: | 220V/50Hz |
| Application: | IC Lead Frame Production |
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| Material: | Steel |
| Mold Design: | 3D CAD |
| Design Software: | UG, ProE, Solidworks, AutoCAD |
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| Surface Treatment: | Mirror Polishing |
| Ejection System: | Ejector Pin, Ejector Sleeve, Ejector Blade, Etc. |
| Features: | Sharp Cutting Edge, Smooth Surface |
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| Application: | Metal Trimming And Forming |
| Compatibility: | Fits With Various Machines |
| Product Active Ingredient: | Sodium Hypochlorite |
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| Product Suitable Surfaces: | Wood, Drywall, Concrete, Tile, Grout, And More |
| Product Brand: | Mold Armor |