Automatic Semiconductor Packaging Equipment With Water Cooling System
Platen Size: | 600 X 600 Mm |
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Clamping Force: | 1000 KN |
Max. Mold Height: | 400 Mm |
Platen Size: | 600 X 600 Mm |
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Clamping Force: | 1000 KN |
Max. Mold Height: | 400 Mm |
Control System: | PLC |
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Temperature Control: | Precision Temperature Control |
Product Type: | Molding Equipment |
Control System: | PLC |
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Dimensions: | 1200mm X 800mm X 1500mm |
Frequency: | 50Hz |
Power Consumption: | 2.5kW |
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Sorting Accuracy: | 99.9% |
Sorting Size Range: | 1mm - 20mm |
Application: | Integrated Circuit (IC) Lead Frame Stamping |
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Material: | Steel |
Mold Hardness: | HRC 50-60 |
Material: | High-quality Steel |
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Mold Life: | 500,000 Shots Or More |
Mold Base: | LKM, DME, HASCO Or Customized |
Capacity: | 200 Tons |
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Clamping Force: | 2000 KN |
Ejector Force: | 50 KN |
Active Ingredient: | Sodium Hypochlorite |
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Application Method: | Spray |
Country Of Origin: | United States |
Capacity: | 100 Tons |
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Clamping Force: | 150 Tons |
Control System: | PLC |
Application: | Semiconductor Manufacturing |
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Capacity: | 1000 Tons |
Control System: | PLC |
Name: | Trim And Form Machine |
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Forming Method: | Pneumatic Press |
Operating Interface: | Touch Screen |
Control System: | PLC Control |
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Dimensions: | 1500mm*1000mm*1200mm |
Power Supply: | 220V/50Hz |
Application: | IC Lead Frame Production |
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Material: | Steel |
Mold Design: | 3D CAD |
Design Software: | UG, ProE, Solidworks, AutoCAD |
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Surface Treatment: | Mirror Polishing |
Ejection System: | Ejector Pin, Ejector Sleeve, Ejector Blade, Etc. |
Features: | Sharp Cutting Edge, Smooth Surface |
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Application: | Metal Trimming And Forming |
Compatibility: | Fits With Various Machines |
Product Active Ingredient: | Sodium Hypochlorite |
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Product Suitable Surfaces: | Wood, Drywall, Concrete, Tile, Grout, And More |
Product Brand: | Mold Armor |