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Semiconductor Molding Equipment

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Contact Person : Zhao
Phone Number : +86 13450030904
WhatsApp : +8613450030904
China Fully Automatic Semiconductor Molding Equipment

Fully Automatic Semiconductor Molding Equipment

MOQ: 1 set
Packaging Details Wooden Packing
Delivery Time 40 days
Place of Origin China
Brand Name TJIN
Certification ISO9001
China Highly Efficient Semiconductor Packaging Equipment

Highly Efficient Semiconductor Packaging Equipment

MOQ: 1 set
Application Semiconductor Industry
Automation Fully Automatic
Capacity Depends On Model
Clamping Force Depends On Model
Control System PLC
China Auto Chip Encapsulation System

Auto Chip Encapsulation System

MOQ: 1 set
Application Semiconductor Industry
Capacity 1000 Tons
Clamping Force 1000 Tons
Control System PLC
Frequency 50Hz
VIDEO China Safety Fully Automated Semiconductor Molding Equipment High Capacity

Safety Fully Automated Semiconductor Molding Equipment High Capacity

MOQ: 1 set
Control System PLC
Temperature Control Precision Temperature Control
Product Type Molding Equipment
Automation Fully Automated
Molding Method Injection Molding
VIDEO China PLC Control Semiconductor Molding Equipment Automatic Encapsulation System

PLC Control Semiconductor Molding Equipment Automatic Encapsulation System

MOQ: 1 set
Control System PLC
Application Semiconductor Industry
Product Type Molding Equipment
Cycle Time Short
Automation Fully Automated
VIDEO China Easy Maintenance Efficient Semiconductor Molding System IC Fabrication Machine

Easy Maintenance Efficient Semiconductor Molding System IC Fabrication Machine

Product Type Molding Equipment
Precision High
Pressure Control Precision Pressure Control
Control System PLC
Cycle Time Short
VIDEO China Electric Powered Semiconductor Molding Equipment Semicon Encapsulation System

Electric Powered Semiconductor Molding Equipment Semicon Encapsulation System

MOQ: 1 set
Application Semiconductor Industry
Automation Fully Automatic
Capacity 1000 Tons
Control System PLC
Cooling System Water Cooling
VIDEO China Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient

Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient

MOQ: 1 set
Application Semiconductor Industry
Capacity 100 Tons
Clamping Force 1000 KN
Control System PLC
Cooling System Water Cooling
VIDEO China High Productivity Semiconductor Molding Equipment Auto Chip Molding System

High Productivity Semiconductor Molding Equipment Auto Chip Molding System

MOQ: 1 set
Application Semiconductor Industry
Capacity 1000 Tons
Clamping Force 10000 KN
Control System PLC
Injection Pressure 200 MPa
VIDEO China Full Auto Semiconductor Production Equipment For Injection Molding

Full Auto Semiconductor Production Equipment For Injection Molding

MOQ: 1 set
Accuracy High
Application Semiconductor Manufacturing
Automation Level Fully Automated
Capacity High
Clamping Force High
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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China
tjin@taijinbdt.com
+86 13450030904
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