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Phone Number :	+86 13450030904
WhatsApp :	+8613450030904

Keywords [ semiconductor production equipment ] match 148 Products.

High Performance Auto Layup Chip Sorter Machine Customized On Demand

Capacity	1000 Chips Per Minute
Control System	PLC
Dimensions	1200mm X 800mm X 1000mm
Material	Stainless Steel
Operating Interface	Touch Screen

2.5kW Electronic Components Chip Sorting Machine Automatic Control

MOQ: 1

Power Consumption	2.5kW
Sorting Accuracy	99.9%
Air Pressure	0.6-0.8MPa
Model	CSM-15
Air Consumption	0.1m³/min

Adjustable Speed Wafer Sorters Auto Array Machine Stable Performance

MOQ: 1 set

Dimensions	1500mm X 800mm X 1200mm
Input Voltage	220V/50Hz
Power Consumption	Less Than 1kW
Product Capacity	Up To 1000 Chips Per Minute
Product Function	Sorts Chips By Size, Shape, And Color

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

MOQ: 1 set

After-Sales Service	Lifetime Maintenance
Application	Injection Molding
Cavity	Single Or Multi
Design Software	UG, ProE, Solidworks, AutoCAD
Ejection System	Ejector Pin, Ejector Plate, Air Ejector

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface, Easy To Use
Advantages	Efficient, Cost-effective, Time-saving
Application	Metal Trimming And Forming
Compatibility	Compatible With Various Press Machines
Customization	Available

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

MOQ: 1

Mold Type	Stamping Mold
Material	Steel
Application	IC Lead Frame Stamping
Mold Cooling System	Water Cooling
Mold Design	3D/2D

15 Channels Chip Sorter Machine

MOQ: 1

Sorting Speed	Up To 500 Chips Per Minute
Material	Stainless Steel
Model	CSM-15
Air Consumption	0.1m³/min
Weight	500kg

Hot Runner MGP Mold For High Precision Parts Ejector Pin Long Span Life

MOQ: 1

Mold Base	LKM, DME, HASCO Or Customized
Mold Life	500,000 Shots Or More
Mold Standard	DME, HASCO, LKM Or Customized
Surface Treatment	Mirror Polishing
Cavity	Single Or Multi

Stainless Steel Semicon Chip Sorting Machine Optical Recognition Method

MOQ: 1 set

Communication Interface	RS232
Control System	PLC
Dimensions	1000mm X 500mm X 800mm
Display	LCD Touch Screen
Material	Stainless Steel

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

MOQ: 1 set

Application	Mold
Cavity	Single/Multi
Color	Silver
Lead Time	4-6 Weeks
Material	Steel

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

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+86 13450030904

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semiconductor production equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

High Performance Auto Layup Chip Sorter Machine Customized On Demand

2.5kW Electronic Components Chip Sorting Machine Automatic Control

Adjustable Speed Wafer Sorters Auto Array Machine Stable Performance

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

15 Channels Chip Sorter Machine

Hot Runner MGP Mold For High Precision Parts Ejector Pin Long Span Life

Stainless Steel Semicon Chip Sorting Machine Optical Recognition Method

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity