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Phone Number :	+86 13450030904
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Keywords [ lead frame molding ] match 50 Products.

Corrosion Resistant Semiconductor Mold Injection Molding Mould

MOQ: 1 set

Application	Manufacturing
Color	Silver
Compatibility	Compatible With Various Machines
Durability	High
Maintenance	Low Maintenance Required

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

MOQ: 1 set

After-Sales Service	Lifetime Maintenance
Application	Injection Molding
Cavity	Single Or Multi
Design Software	UG, ProE, Solidworks, AutoCAD
Ejection System	Ejector Pin, Ejector Plate, Air Ejector

MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

MOQ: 1 set

Application	Mold Making
Coating	Available
Color	Silver
Durability	High
Heat Treatment	Available

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

MOQ: 1 set

Application	Injection Molding
Cavity	Single Or Multi-cavity
Cooling System	Water Or Oil Cooling
Ejection Type	Ejector Pin, Ejector Sleeve, Or Air Poppet
Gate Type	Edge Gate, Pin Point Gate, Or Sub Gate

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

MOQ: 1 set

Application	Mold
Cavity	Single/Multi
Color	Silver
Lead Time	4-6 Weeks
Material	Steel

Customizable Semiconductor Mold MGP Sealing Mold High Precision

MOQ: 1 set

Application	Manufacturing
Compatibility	Versatile
Corrosion Resistance	High
Design	Customizable
Durability	High

ISO9001 Certified SOD Series MGP Mold Plastic Seal Molds Hardness HRC62-64

MOQ: 1 set

Application	Manufacturing
Cavity	Single/Multi
Durability	High
Ejection System	Pin/Plate
Lead Time	Short

Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

MOQ: 1 set

Application	Mold Making
Color	Silver
Compatibility	Universal
Corrosion Resistance	Yes
Durability	High

Stainless Steel DIP40 MGP Mould Semiconductor Packaging Mold

MOQ: 1 set

Application	Plastic Parts Production
Cavity	Single/Multi
Lead Time	4-8 Weeks
Material	Stainless Steel
Mold Base	LKM, DME, HASCO, Etc.

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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

MOQ: 1 set

Application	Semiconductor Industry
Automation Grade	Automatic
Capacity	Depends On The Model
Clamping Force	Depends On The Model
Control System	PLC

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+86 13450030904

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lead frame molding

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Corrosion Resistant Semiconductor Mold Injection Molding Mould

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

Customizable Semiconductor Mold MGP Sealing Mold High Precision

ISO9001 Certified SOD Series MGP Mold Plastic Seal Molds Hardness HRC62-64

Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

Stainless Steel DIP40 MGP Mould Semiconductor Packaging Mold

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated