Semicon Transfer Molding
【Performance parameters】
● Model pressure: 98-1764kn;
● injection molding pressure: 4.9-29.4kn can be adjusted;
● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm in length, 0.15-1.2mm thick;
● Applicable plastic seal size: diameter φ 11 ~ 20mm, length/diameter 1.2 ~ 2.0 (MAX 35mm).
| Technical Parameters | Value |
|---|---|
| Application | Semiconductor Industry |
| Molding Method | Injection Molding |
| Temperature Control | Precision Temperature Control |
| Automation | Fully Automated |
| Product Type | Molding Equipment |
| Capacity | High |
| Energy Consumption | Low |
| Safety Features | Advanced |
| Material | Plastic |
| Precision | High |
| Additional Features | Automatic Molding Press, Plasticizing Press, Fully Automatic Molding System |
Welcome to the world of high precision and advanced technology with TJIN 002 - the ultimate Automatic Molding Machine for the Semiconductor Industry. Trust us to provide you with the best solutions for all your molding needs.
TJIN is a renowned name in the world of molding equipment, known for its high-quality products, advanced technology, and exceptional customer service. With our TJIN 002 model, we are taking a step further to revolutionize the Semiconductor Industry.
TJIN 002 is our latest model of Automatic Molding Machine, specially designed for the Semiconductor Industry. It is equipped with state-of-the-art features and advanced technology, making it the most efficient and reliable molding machine in the market.
TJIN 002 is proudly designed and manufactured in China, the hub of technological innovations. With our team of highly skilled and experienced engineers, we ensure that each and every machine is built to perfection and meets the highest quality standards.
At TJIN, your safety is our top priority. That's why our TJIN 002 model is equipped with advanced safety features to ensure a safe and secure working environment. From emergency stop buttons to overload protection, we have got you covered.
When it comes to molding, precision is crucial. With TJIN 002, you can expect the highest level of precision in every molding process. Our machine is designed to deliver accurate and consistent results, ensuring that every product meets your exact specifications.
We understand that time is money in the fast-paced Semiconductor Industry. That's why we have designed our TJIN 002 model to require minimal maintenance. With easy-to-follow instructions and simple maintenance procedures, you can save both time and money.
With rising energy costs, it is essential to invest in equipment that is energy-efficient. TJIN 002 is designed to consume low energy while delivering high-quality results. This not only helps in reducing your energy bills but also contributes to a greener and more sustainable environment.
TJIN 002 is a high-capacity Automatic Molding Press, designed to meet the demands of the fast-paced Semiconductor Industry. With its advanced technology and efficient design, it can handle large volumes of production without compromising on quality.
TJIN 002 is the perfect solution for all your molding needs in the Semiconductor Industry. Whether you need to mold small, precise components or large, complex structures, our machine can handle it all with ease. Here are some of the common applications and scenarios where TJIN 002 can be used:
With TJIN 002, you can achieve high precision, efficiency, and productivity, making it a valuable addition to your production line. So why wait? Contact us today to learn more about our product and how it can benefit your business.
Brand Name: TJIN
Model Number: 002
Place of Origin: China
The TJIN Semiconductor Molding Equipment is a top-of-the-line product designed specifically for the semiconductor industry. It is a Fully Automated Molding Equipment that provides efficient and high-quality encapsulation for semiconductor products. With its Advanced Safety Features and Short Cycle Time, it is the perfect choice for any semiconductor manufacturing facility.
The TJIN Semiconductor Molding Equipment is specifically designed for use in the semiconductor industry. It can easily handle a wide range of products and is perfect for any encapsulation needs.
With its Fully Automated system, the TJIN Semiconductor Molding Equipment provides a seamless and efficient encapsulation process. The Advanced Safety Features ensure the safety of both the equipment and the operators. Additionally, the Short Cycle Time allows for a faster production process, increasing productivity and reducing costs.
For more information about our TJIN Semiconductor Molding Equipment and our customized services, please contact us at sales@tjin.com or visit our website at www.tjin.com.
Our Semiconductor Molding Equipment is carefully packaged and shipped to ensure safe delivery and protection of the product.
We offer both domestic and international shipping for our Semiconductor Molding Equipment. Our standard shipping method is via air or sea freight, depending on the destination.
For domestic shipping, we partner with reliable carriers to ensure timely and secure delivery.
For international shipping, we work closely with our logistics partners to handle all customs and documentation requirements for smooth delivery to your location.
Once the equipment is shipped, we provide you with a tracking number so you can monitor the status of your delivery.
For urgent orders, we also offer expedited shipping options for an additional fee.
At Semiconductor Molding Equipment, we take great care in packaging and shipping our products to ensure they arrive at your doorstep in perfect condition.
