| Mold Life | 500,000 Shots Or More |
|---|---|
| Runner System | Hot Runner Or Cold Runner |
| Gate Type | Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc. |
| Mold Base | LKM, DME, HASCO Or Customized |
| Mold Standard | DME, HASCO, LKM Or Customized |
| Application | Integrated Circuit (IC) Lead Frame Stamping |
|---|---|
| Material | Steel |
| Mold Hardness | HRC 50-60 |
| Mold Life | 500,000-1,000,000 Shots |
| Mold Material | SKD11, SKH-9, DC53, Or Customized |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 5000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Capacity | 1000 Tons |
|---|---|
| Clamping Force | 1000 KN |
| Control System | PLC Control |
| Ejector Force | 50 KN |
| Ejector Stroke | 300 Mm |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC Control |
| Injection Speed | 1000 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Automation Grade | Automatic |
| Capacity | Depends On Model |
| Clamping Force | Depends On Model |
| Control System | PLC |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Cooling System | Water Cooling |
| Heating Power | 10 KW |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | 1000 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |