| Capacity | 2000 Tons |
|---|---|
| Clamping Force | 2000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Injection Speed | 300 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | High |
| Control System | PLC |
| Cooling System | Water Cooling |
| Application | Mold Making |
|---|---|
| Color | Silver |
| Compatibility | Universal |
| Corrosion Resistance | Yes |
| Durability | High |
| Application | Stamping Of IC Lead Frames |
|---|---|
| Compatibility | Suitable For Various IC Lead Frame Sizes |
| Customization | Available |
| Delivery | By Sea Or Air |
| Dimension | Customized |
| Control System | PLC |
|---|---|
| Application | Semiconductor Industry |
| Product Type | Molding Equipment |
| Cycle Time | Short |
| Automation | Fully Automated |
| Capacity | 1000 Tons |
|---|---|
| Clamping Force | 1000 Tons |
| Ejector Force | 200 Tons |
| Injection Pressure | 2000 Bar |
| Injection Unit | Single |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 5000 KN |
| Control System | PLC |
| Cooling Zones | 4 |
| Accuracy | High |
|---|---|
| Application | IC Lead Frame Production |
| Cavity | Single |
| Cooling System | Water Cooling |
| Dimension | Customized |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | High |
| Clamping Force | High |
| Control System | PLC |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC |
| Injection Pressure | 2000 Bar |