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Phone Number :	+86 13450030904
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Keywords [ semiconductor processing equipment ] match 140 Products.

QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

MOQ: 1 set

Application	Injection Molding
Cavity	Single Or Multi-cavity
Cooling System	Water Cooling Or Air Cooling
Ejection System	Ejector Pins Or Ejector Plate
Gate Type	Edge Gate, Pin Point Gate Or Sub Gate

Auto IC Scheduler Chip Sorting Machine Strong Wear Resistance

MOQ: 1 set

Capacity	1000 Chips Per Minute
Color	Silver
Communication	Ethernet
Dimensions	1200mm X 800mm X 1500mm
Interface	Touch Screen

High Precision Molding Molds Trim Form Mold High Efficiency Wear Proof

MOQ: 1 set

Accuracy	High Accuracy
Application	Metal Forming
Compatibility	Compatible With Various Machines
Durability	Long-lasting
Efficiency	High Efficiency

Non Normal Standard Custom Metal Stamping Mold For Integrated Circuit

MOQ: 1 set

Application	Integrated Circuit Manufacturing
Compatibility	Various IC Sizes
Cost Efficiency	High
Dimension	Customized
Durability	Long-lasting

Rectangular Fda Approved MGP Mould Plastic Seal Mold Heat Resistance

MOQ: 1 set

Bpa Free	Yes
Color	White
Dishwasher Safe	Yes
Fda Approved	Yes
Heat Resistance	Up To 450°F

Customized Size IC Lead Frame Stamping Mold With Nickel Plating

MOQ: 1

Hardness	HRC 50-60
Tolerance	±0.01mm
Mold Design	3D/2D
Application	IC Lead Frame Stamping
Surface Treatment	Nickel Plating

Steel IC Lead Frame Stamping Mold

MOQ: 1 set

Application	Integrated Circuit Lead Frame Production
Cavity Number	Single Or Multi-cavity
Cooling System	Water Cooling
Design Software	UG, ProE, Solidworks, AutoCAD
Durability	100,000-500,000 Shots

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

MOQ: 1 set

Application	Mold
Cavity	Single/Multi
Color	Silver
Lead Time	4-6 Weeks
Material	Steel

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

MOQ: 1 set

Application	Injection Molding
Cavity	Single Or Multi-cavity
Cooling System	Water Or Oil Cooling
Ejection Type	Ejector Pin, Ejector Sleeve, Or Air Poppet
Gate Type	Edge Gate, Pin Point Gate, Or Sub Gate

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection

MOQ: 1

Mold Life	500,000 Shots Or More
Runner System	Hot Runner Or Cold Runner
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Mold Base	LKM, DME, HASCO Or Customized
Mold Standard	DME, HASCO, LKM Or Customized

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

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+86 13450030904

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor processing equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

Auto IC Scheduler Chip Sorting Machine Strong Wear Resistance

High Precision Molding Molds Trim Form Mold High Efficiency Wear Proof

Non Normal Standard Custom Metal Stamping Mold For Integrated Circuit

Rectangular Fda Approved MGP Mould Plastic Seal Mold Heat Resistance

Customized Size IC Lead Frame Stamping Mold With Nickel Plating

Steel IC Lead Frame Stamping Mold

Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection