Water Cooling System IC Lead Frame Stamping Mold Customized Size 4-6 Weeks Lead Time
The IC Lead Frame Stamping Mold is a high-quality and durable mold designed for producing high-precision IC lead frames. This mold is customized according to the specific requirements of each customer, ensuring efficient and accurate production of IC lead frames.
The size of the mold can be customized to meet the specific needs of the customer. The mold size can range from small to large, depending on the size of the IC lead frame required. This flexibility in size allows for a wide range of production possibilities.
The mold is treated with nickel plating, providing a smooth and durable surface. This surface treatment increases the longevity of the mold, ensuring consistent and high-quality production of IC lead frames.
The IC Lead Frame Stamping Mold is designed using advanced 3D/2D technology, allowing for precise and accurate mold design. This ensures that the final product meets the exact specifications and requirements of the customer.
The mold is equipped with a water cooling system, which helps to maintain a consistent temperature during production. This cooling system is essential in ensuring the efficient production of high-quality IC lead frames.
The IC Lead Frame Stamping Mold is a type of stamping mold, which is commonly used in the production of IC lead frames. This type of mold is ideal for high-precision and efficient production of IC lead frames.
Overall, the IC Lead Frame Stamping Mold is a top-of-the-line product that offers high-quality and efficient production of IC lead frames. Its customizable size, advanced design, and durable surface make it an essential tool in the production of electronic components.
Key Features:
Brand Name: TJIN
Model Number: 006
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Mold Material: NAK80, S136, SKD61, Etc.
Mold Cooling System: Water Cooling
Lead Time: 4-6 Weeks
Tolerance: ±0.01mm
Surface Treatment: Nickel Plating
The TJIN 006 IC Lead Frame Stamping Mold is a high-quality mold designed for the production of lead frames used in integrated circuits (IC). Made from top-grade materials such as NAK80, S136, and SKD61, this mold ensures precision and durability for long-lasting use.
This product is widely used in the electronics industry, specifically in the production of integrated circuits. The lead frame mold is an essential tool in the manufacturing process of ICs, ensuring the precise and efficient production of lead frames. It is suitable for use in various electronic devices such as smartphones, computers, and other high-life electronics.
Our lead frame mold is the perfect choice for high-life electronics due to its high precision, durability, and efficiency. With our state-of-the-art technology and top-grade materials, we guarantee the best quality mold for your production needs. Trust TJIN for all your IC lead frame stamping mold requirements and experience the difference in your production process.
Brand Name: TJIN
Model Number: 006
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Mold Size: Customized
Hardness: HRC 50-60
Mold Type: Stamping Mold
Mold Base: LKM, DME, HASCO, Etc.
Tolerance: ±0.01mm
At TJIN, we offer customized services for our IC Lead Frame Stamping Mold to meet the specific needs of our clients. Our Semicon IC Lead Frame Mold is designed with precision and is suitable for various applications in the semiconductor industry. We understand the importance of customization and strive to provide high-quality solutions that meet the unique requirements of our customers.
The IC Lead Frame Stamping Mold is carefully packaged to ensure safe delivery to our customers. The mold is first wrapped in protective materials, such as bubble wrap or foam, to prevent any damage during transit. It is then placed in a sturdy cardboard box with additional padding to further protect it.
The package is labeled with the product name and description, as well as any necessary handling instructions. We also include a packing slip with the customer's order information for easy identification.
For shipping, we use trusted and reliable shipping carriers to ensure timely and secure delivery. Customers can choose from a variety of shipping options based on their location and preferred delivery speed.
With our careful packaging and efficient shipping methods, we guarantee that our IC Lead Frame Stamping Mold will arrive at your doorstep in perfect condition.
