Application | Semiconductor Manufacturing |
---|---|
Capacity | 1000 Tons |
Control System | PLC |
Frequency | 50Hz |
Injection Pressure | 200 MPa |
Capacity | 100 Tons |
---|---|
Clamping Force | 150 Tons |
Control System | PLC |
Cooling System | Water |
Dimensions | 2000 X 1500 X 3000 Mm |
Control System | PLC |
---|---|
Cooling System | Water |
Frequency | 50Hz |
Heating Zones | 6 |
Injection Pressure | 200 MPa |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automated |
Capacity | High |
Control System | PLC |
Frequency | 50Hz/60Hz |
Capacity | 100 Tons |
---|---|
Clamping Force | 1000 KN |
Control System | PLC |
Frequency | 50/60Hz |
Injection Speed | 200 Mm/s |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 1000 KN |
Control System | PLC |
Injection Speed | 200 Mm/s |
Capacity | 100 Tons |
---|---|
Platen Size | 600 X 600 Mm |
Type | Vertical Injection Molding Machine |
Injection Unit | Single |
Heating Power | 12 KW |
Product Type | Molding Equipment |
---|---|
Precision | High |
Pressure Control | Precision Pressure Control |
Control System | PLC |
Cycle Time | Short |
Clamping Force | 1000 KN |
---|---|
Type | Vertical Injection Molding Machine |
Capacity | 120 Tons |
Screw Diameter | 35 Mm |
Weight | 5 Tons |
Control System | PLC |
---|---|
Temperature Control | Precision Temperature Control |
Product Type | Molding Equipment |
Automation | Fully Automated |
Molding Method | Injection Molding |