| Application | Semiconductor Manufacturing |
|---|---|
| Capacity | 1000 Tons |
| Control System | PLC |
| Frequency | 50Hz |
| Injection Pressure | 200 MPa |
| Capacity | 100 Tons |
|---|---|
| Clamping Force | 150 Tons |
| Control System | PLC |
| Cooling System | Water |
| Dimensions | 2000 X 1500 X 3000 Mm |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automated |
| Capacity | High |
| Control System | PLC |
| Frequency | 50Hz/60Hz |
| Capacity | 100 Tons |
|---|---|
| Clamping Force | 1000 KN |
| Control System | PLC |
| Frequency | 50/60Hz |
| Injection Speed | 200 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Injection Speed | 200 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 10000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Capacity | 100 Tons |
|---|---|
| Platen Size | 600 X 600 Mm |
| Type | Vertical Injection Molding Machine |
| Injection Unit | Single |
| Heating Power | 12 KW |
| Product Type | Molding Equipment |
|---|---|
| Precision | High |
| Pressure Control | Precision Pressure Control |
| Control System | PLC |
| Cycle Time | Short |
| Control System | PLC |
|---|---|
| Temperature Control | Precision Temperature Control |
| Product Type | Molding Equipment |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Control System | PLC |
|---|---|
| Energy Consumption | Low |
| Maintenance | Easy |
| Molding Method | Injection Molding |
| Precision | High |