Fully Automatic Transfer Molding
【Performance Parameters】
● Model pressure: 98-1764kn;
● injection molding pressure: 4.9-29.4kn can be adjusted;
● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long;
● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm;
● Full servo control system, PLC (Omron)+upper machine;
● Win10+15 -inch touch screen+touch keyboard;
● CCD image detection, feeding anti -counter -detection;
● Standardized mold structure, convenient replacement;
● High -efficient ingredients, cakes, mixing components, aluminum boxes;
● Support up to up to 4 sets of pressure machines to expand flexibly to achieve high UPH;
● Equipped with visual system recognition direction;
● Automatically enter the box, double -receiving box stacked collection;
| Product Name | Semiconductor Molding Equipment |
|---|---|
| Automation | Fully Automated |
| Control System | PLC |
| Material | Plastic |
| Capacity | High |
| Maintenance | Easy |
| Product Type | Molding Equipment |
| Safety Features | Advanced |
| Application | Semiconductor Industry |
| Temperature Control | Precision Temperature Control |
| Precision | High |
| Key Features | Fully Automatic Molding System, Automatic Molding Machine, Automatic Molding Press |
This fully automatic molding system is the perfect solution for all your semiconductor molding needs. With its advanced safety features and high-quality materials, this automatic molding machine guarantees a high efficiency and precision in the molding process.
The Semiconductor Molding Equipment is designed to meet the demanding requirements of the semiconductor industry. It utilizes the latest technology to provide a reliable and efficient solution for injection molding of plastic materials. With its fully automatic molding system, this equipment is capable of producing high-quality products with precision pressure control, making it an indispensable tool for any semiconductor company.
Safety is a top priority in the semiconductor industry and this molding equipment has been designed with advanced safety features to ensure the protection of both the operator and the product. These safety features include emergency stop buttons, safety doors, and sensors to prevent accidents and protect the integrity of the products being molded.
The Semiconductor Molding Equipment is specifically designed for molding plastic materials commonly used in the semiconductor industry. These materials include polycarbonate, polyethylene, polypropylene, and other thermoplastics. With its high-quality materials, this molding equipment can produce products with excellent strength, durability, and chemical resistance.
This equipment utilizes injection molding, which is a highly efficient and precise method of molding plastic materials. The molten plastic is injected into a mold under high pressure, creating a precise and uniform shape. This method allows for the production of complex and intricate designs with high accuracy.
The Semiconductor Molding Equipment has a high production capacity, making it suitable for large-scale manufacturing. It can produce a high volume of products in a relatively short period of time, increasing productivity and reducing production costs for semiconductor companies.
Precision pressure control is essential in the semiconductor industry to ensure the quality and consistency of the products being molded. This molding equipment has advanced pressure control technology, allowing for precise and accurate control of the molding process. This results in high-quality products with minimal defects.
The Semiconductor Molding Equipment is a state-of-the-art automatic molding press that offers high efficiency, precision, and safety. With its advanced features and high-quality materials, it is the perfect solution for all your semiconductor molding needs. Invest in this equipment and take your semiconductor manufacturing process to the next level.
TJIN 002 is an advanced molding equipment designed for the semiconductor industry. It is an automatic encapsulation system that uses high precision technology to produce efficient and reliable results. This fully automated molding equipment is manufactured in China by TJIN and is widely used in the semiconductor industry for its cost-effectiveness and advanced technology.
TJIN is a well-known brand in the semiconductor industry, known for its high-quality and reliable products. TJIN 002 is one of their flagship products, designed to meet the specific needs of the semiconductor industry.
The model number 002 signifies that this is the second version of the TJIN semiconductor molding equipment. It is an upgraded and improved version of its predecessor, with enhanced features and capabilities.
TJIN 002 is proudly manufactured in China, a country known for its expertise in the semiconductor industry. The equipment is made with high-quality materials and advanced technology, ensuring its reliability and efficiency.
TJIN 002 is specifically designed for use in the semiconductor industry. It is used for encapsulating and molding semiconductor components, such as integrated circuits, transistors, and diodes. Its high precision and advanced technology make it an ideal choice for this industry.
TJIN 002 is equipped with advanced safety features to ensure the safety of its users and the components being molded. These safety features include automatic shutdown in case of any malfunction, overheat protection, and emergency stop button.
The cycle time of TJIN 002 is short, meaning it can produce a large number of molded components in a short period. This makes it an efficient and time-saving choice for semiconductor manufacturers.
TJIN 002 is primarily made of plastic, a durable and lightweight material that is commonly used in the semiconductor industry. The plastic used in this equipment is of high quality, ensuring the stability and precision of the molding process.
TJIN 002 is a fully automated molding equipment, meaning it requires minimal human supervision. It is equipped with advanced technology and sensors that can automatically detect and correct any errors, making it an efficient and reliable choice for semiconductor manufacturers.
TJIN 002 can be used in various scenarios within the semiconductor industry. Some of the common applications include:
TJIN 002 is an advanced and efficient molding equipment designed for the semiconductor industry. Its high precision, reliability, and cost-effectiveness make it a popular choice among semiconductor manufacturers. With its fully automated system and advanced technology, TJIN 002 is a valuable addition to any semiconductor production facility.
Brand Name: TJIN
Model Number: 002
Place of Origin: China
Safety Features: Advanced
Temperature Control: Precision Temperature Control
Cycle Time: Short
Molding Method: Injection Molding
Product Type: Molding Equipment
At TJIN, we understand the unique needs of our customers in the semiconductor industry. That's why we offer a comprehensive customization service for our Semiconductor Molding Equipment. With our advanced safety features, precision temperature control, and short cycle time, our equipment is designed to meet the high demands of the industry.
Our customization service allows you to tailor the equipment to your specific needs and requirements. Our experienced team will work closely with you to understand your production process and provide solutions that will optimize your operations.
Whether you need an Automatic Molding Machine, Automatic Molding Press, or are looking for a reliable Automatic Molding Machine Supplier, TJIN has got you covered. Trust us to provide you with the best quality equipment that will enhance your production efficiency and meet your unique demands. Contact us today to learn more about our customization service for Semiconductor Molding Equipment.
Our Semiconductor Molding Equipment is carefully packaged and shipped to ensure safe delivery to our customers.
The equipment is first wrapped in protective materials to prevent any damage during transportation. It is then placed in a sturdy cardboard box, with additional cushioning materials to further protect it.
We also take extra precautions when packaging delicate components, such as using anti-static materials to prevent any damage from static electricity.
We offer a variety of shipping options to accommodate our customers' needs. Our equipment can be shipped via air, sea, or land depending on the destination and urgency of the order.
We work with trusted shipping partners to ensure timely and safe delivery. Our team also carefully tracks and monitors the shipment to provide updates to our customers.
For international shipments, we handle all necessary customs and documentation to ensure a smooth delivery process.
Before the equipment is shipped, it undergoes a final inspection to ensure it meets our high-quality standards. Any necessary adjustments or repairs are made before packaging to avoid any issues upon delivery.
We take great pride in our packaging and shipping process to ensure our customers receive their Semiconductor Molding Equipment in perfect condition and on time.
