Automatic Molding Press
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
| Parameter | Value |
|---|---|
| Type | Vertical Injection Molding Machine |
| Model | SM-1000 |
| Screw Diameter | 35 mm |
| Injection Unit | Single |
| Clamping Force | 1000 KN |
| Max. Mold Height | 400 mm |
| Capacity | 100 Tons |
| Cooling System | Water |
| Heating Power | 12 KW |
| Weight | 5 Tons |
| Additional Features | Auto Packaging Equipment, Auto Transfer Molding, Auto Packaging Equipment |
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Platen Size: 600 X 600 Mm
Cooling System: Water
Injection Pressure: 200 MPa
Capacity: 100 Tons
Heating Power: 12 KW
The Semiconductor Molding Machine by TJIN is a top-of-the-line product that is widely used in the packaging and manufacturing industry. This high-performance machine is designed to cater to the needs of precision molding for semiconductor products.
With its advanced auto packaging equipment, the Semiconductor Molding Machine ensures efficient and accurate packaging of delicate semiconductor components. The machine is equipped with a precise packaging system that guarantees the safety and integrity of the products during the packaging process.
The TJIN Semiconductor Molding Machine also features an auto transfer molding function that allows for seamless and efficient transfer of the molded products onto the packaging line. This eliminates the need for manual handling, reducing the risk of damage to the delicate semiconductor products.
The main function of this product is to mold and shape semiconductor components with utmost precision. The machine is equipped with a powerful hydraulic system that ensures consistent and accurate molding of the products. The platen size of 600 x 600 mm provides enough space for large-scale production while maintaining precision and accuracy.
The TJIN Semiconductor Molding Machine is the perfect choice for precision molding of semiconductor products due to its advanced features and attributes. With its high-quality brand, ISO9001 certification, and secure packaging, customers can trust in the quality and reliability of this product. The auto packaging and transfer functions ensure efficient and accurate production, while the powerful hydraulic system and large platen size guarantee precision and consistency. With TJIN Semiconductor Molding Machine, customers can expect top-notch performance and results.
The TJIN Semiconductor Molding Machine is a top-of-the-line product that caters to the needs of precision molding for semiconductor products. With its advanced features, high-quality brand, and reliable performance, this machine is a must-have for any packaging and manufacturing industry. Trust in TJIN for all your semiconductor molding needs.
