Automatic Encapsulation Equipment
Features
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
| Parameter | Value |
|---|---|
| Type | Vertical Injection Molding Machine |
| Model | SM-1000 |
| Screw Diameter | 35 mm |
| Injection Unit | Single |
| Clamping Force | 1000 KN |
| Max. Mold Height | 400 mm |
| Capacity | 100 Tons |
| Cooling System | Water |
| Heating Power | 12 KW |
| Weight | 5 Tons |
| Additional Features | Auto Packaging Equipment, Auto Transfer Molding, Auto Packaging Equipment |
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Platen Size: 600 X 600 Mm
Cooling System: Water
Injection Pressure: 200 MPa
Capacity: 100 Tons
Heating Power: 12 KW
The Semiconductor Molding Machine by TJIN is a top-of-the-line product that is widely used in the packaging and manufacturing industry. This high-performance machine is designed to cater to the needs of precision molding for semiconductor products.
With its advanced auto packaging equipment, the Semiconductor Molding Machine ensures efficient and accurate packaging of delicate semiconductor components. The machine is equipped with a precise packaging system that guarantees the safety and integrity of the products during the packaging process.
The TJIN Semiconductor Molding Machine also features an auto transfer molding function that allows for seamless and efficient transfer of the molded products onto the packaging line. This eliminates the need for manual handling, reducing the risk of damage to the delicate semiconductor products.
The main function of this product is to mold and shape semiconductor components with utmost precision. The machine is equipped with a powerful hydraulic system that ensures consistent and accurate molding of the products. The platen size of 600 x 600 mm provides enough space for large-scale production while maintaining precision and accuracy.
The TJIN Semiconductor Molding Machine is the perfect choice for precision molding of semiconductor products due to its advanced features and attributes. With its high-quality brand, ISO9001 certification, and secure packaging, customers can trust in the quality and reliability of this product. The auto packaging and transfer functions ensure efficient and accurate production, while the powerful hydraulic system and large platen size guarantee precision and consistency. With TJIN Semiconductor Molding Machine, customers can expect top-notch performance and results.
The TJIN Semiconductor Molding Machine is a top-of-the-line product that caters to the needs of precision molding for semiconductor products. With its advanced features, high-quality brand, and reliable performance, this machine is a must-have for any packaging and manufacturing industry. Trust in TJIN for all your semiconductor molding needs.
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Weight: 5 Tons
Cooling System: Water
Platen Size: 600 X 600 Mm
Model: SM-1000
Screw Diameter: 35 Mm
Auto Packaging Equipment, Auto Transfer Molding, Auto Packaging Equipment - these are just a few of the features that make the Semiconductor Molding Machine from TJIN stand out in the market. But what sets it apart even more is our commitment to providing high-quality, customized service to meet the specific needs of our clients.
With years of experience in the industry, we understand that every client has unique requirements when it comes to their molding machine. That's why we offer a range of customized services to ensure that our product meets your exact specifications.
Our team of experts will work closely with you to understand your needs and provide tailored solutions, from design and engineering to production and delivery. Our ISO9001 certification guarantees the highest quality standards, and our minimum order quantity of 1 allows for flexibility and cost-effectiveness.
When it comes to packaging, we know that protection and safety are top priorities. That's why we use wooden packaging to ensure that your machine arrives in perfect condition. Our delivery time of 40 days and payment terms of TT make the process smooth and hassle-free.
The Semiconductor Molding Machine from TJIN weighs 5 tons and is equipped with a water cooling system, making it efficient and reliable. The platen size of 600 x 600 mm and screw diameter of 35 mm further enhance its performance, making it a top choice for your molding needs.
Trust TJIN for all your semiconductor molding needs and experience our top-notch customized service. Contact us now for more information.
For the safe transportation of our Semiconductor Molding Machine, we use sturdy wooden crates reinforced with metal strapping. Each component of the machine is carefully packed and secured to prevent any damage during shipping.
The machine will be shipped via a reputable freight company, with the option for air or sea freight depending on your location and preference. We can also arrange for door-to-door delivery for an additional fee.
Our standard lead time for packaging and shipping is 2-3 weeks, but we can expedite this process if needed. Once the machine is ready for shipment, we will provide you with a tracking number so you can monitor its progress.
We take great care to ensure that our Semiconductor Molding Machine arrives at your location in perfect condition. However, in the rare event of any damage during shipping, please contact us immediately so we can assist in resolving the issue.
Please note that any additional customs fees or taxes incurred during shipping will be the responsibility of the buyer. We will provide all necessary documentation to facilitate the customs process.
Thank you for choosing our Semiconductor Molding Machine. We are confident that it will arrive safely and ready for use in your production facility.
