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1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision

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1000 Tons Semiconductor Molding Equipment Plastic Seal Device High Precision
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Features
Specifications
Capacity: 1000 Tons
Clamping Force: 1000 Tons
Ejector Force: 200 Tons
Injection Pressure: 2000 Bar
Injection Unit: Single
Max. Shot Size: 5000g
Model: SM-1000
Mold Height: 1000mm
Opening Stroke: 2000mm
Platen Size: 2000mm X 2000mm
Power Supply: 3 Phase, 380V, 50Hz
Screw Diameter: 150mm
Type: Injection Molding Machine
High Light:

1000 Tons Semiconductor Molding Equipment

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Semiconductor Molding Equipment High Precision

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semiconductor molding machine High Precision

Basic Infomation
Place of Origin: China
Brand Name: TJIN
Certification: ISO9001
Payment & Shipping Terms
Packaging Details: Wooden Packing
Delivery Time: 40 days
Product Description

Automatic Semiconductor Plastic seal Device

 

FAQ:

  • Q: What is the brand name of this product?
  • A: The brand name of this product is TJIN.
  • Q: What is the model number of this product?
  • A: The model number of this product is 002.
  • Q: Where is this product manufactured?
  • A: This product is manufactured in China.
  • Q: What is the function of this product?
  • A: This product is used for molding semiconductors.
  • Q: What is the working temperature of this product?
  • A: The working temperature of this product is between 150-200 degrees Celsius.
  • Q: Is this product suitable for mass production?
  • A: Yes, this product is designed for high volume production of semiconductors.

 

Features:

● Semiconductor plastic sealing equipment is also known as full-automatic plastic sealing machine, automatic plastic sealing of chips, semiconductor devices and other products.

● Full servo control system, PLC (OMRON) + upper computer;

● WIN10 + 15-inch touch screen + touch keyboard.

● CCD image detection, feeding anti-reverse detection

● Standardized mold structure, convenient replacement;

● High-efficiency cake loading component, aluminum cassette loading;

● Support flexible expansion of up to 4 groups of presses to realize high UPH;

 

Technical Parameters:

Attribute Value
Product Type Molding Equipment
Application Semiconductor Industry
Precision High
Control System PLC
Temperature Control Precision Temperature Control
Automation Fully Automated
Molding Method Injection Molding
Energy Consumption Low
Pressure Control Precision Pressure Control
Cycle Time Short
Key Features Descriptions
Fully Automatic Molding System This molding equipment is equipped with a fully automatic system, allowing for efficient and convenient operation.
Automatic Molding Machine This machine can automatically carry out the molding process, saving time and effort for the user.
Automatic Molding Machine This molding equipment is specifically designed for use in the semiconductor industry, ensuring high precision results.

Packing and Shipping:

Packaging and Shipping of Semiconductor Molding Equipment

Our Semiconductor Molding Equipment is carefully packaged to ensure safe and secure delivery to our customers. Depending on the size and weight of the equipment, it will be packaged in either wooden crates or heavy-duty cardboard boxes.

All electronic components are protected with anti-static packaging materials to prevent any potential damage during shipping. The equipment is also secured with foam padding and bubble wrap to further cushion it during transport.

For international shipping, we use a combination of air and sea freight to deliver our products to our customers. Each shipment is carefully tracked and monitored to ensure timely delivery and to provide our customers with updates on the status of their order.

Upon arrival at the destination, our customers will be responsible for any customs clearance procedures and fees. We will provide all necessary documentation to assist with the process.

If there are any special packaging or shipping requests, please inform us at the time of purchase so that we can accommodate your needs.

Thank you for choosing our Semiconductor Molding Equipment. We strive to provide the best packaging and shipping service to ensure your complete satisfaction.

 

Customization:

TJIN Semiconductor Molding Equipment Customized Service

Brand Name: TJIN

Model Number: 002

Place of Origin: China

Precision: High

Capacity: High

Maintenance: Easy

Control System: PLC

Safety Features: Advanced

Our company, TJIN, specializes in providing customized services for our Automatic Encapsulation System, Automatic Molding Machine, and Automatic Molding Machine for Semiconductors. Our high precision and high capacity machines are designed and manufactured in China, making them both reliable and cost-effective.

With our easy maintenance and advanced safety features, our customers can trust in the quality and durability of our products. Our control system utilizes PLC technology, ensuring efficient and reliable operation.

At TJIN, we understand the importance of meeting the unique needs and specifications of our clients in the semiconductor industry. That's why we offer personalized customization services to meet your exact requirements. Our team of experts will work closely with you to design and develop a tailor-made solution that meets your specific production needs.

Choose TJIN for your Semiconductor Molding Equipment needs and experience the benefits of our top-of-the-line products and exceptional customized service. Contact us today to learn more!

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Get in touch with us
Tel : +86 13450030904
Fax : 86-769-81761210
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