Brand Name: TJIN
Model Number: 002
Place of Origin: China
Precision: High
Capacity: High
Maintenance: Easy
Control System: PLC
Safety Features: Advanced
Our company, TJIN, specializes in providing customized services for our Automatic Encapsulation System, Automatic Molding Machine, and Automatic Molding Machine for Semiconductors. Our high precision and high capacity machines are designed and manufactured in China, making them both reliable and cost-effective.
With our easy maintenance and advanced safety features, our customers can trust in the quality and durability of our products. Our control system utilizes PLC technology, ensuring efficient and reliable operation.
At TJIN, we understand the importance of meeting the unique needs and specifications of our clients in the semiconductor industry. That's why we offer personalized customization services to meet your exact requirements. Our team of experts will work closely with you to design and develop a tailor-made solution that meets your specific production needs.
Choose TJIN for your Semiconductor Molding Equipment needs and experience the benefits of our top-of-the-line products and exceptional customized service. Contact us today to learn more!
| Attribute | Value |
|---|---|
| Product Type | Molding Equipment |
| Application | Semiconductor Industry |
| Precision | High |
| Control System | PLC |
| Temperature Control | Precision Temperature Control |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Energy Consumption | Low |
| Pressure Control | Precision Pressure Control |
| Cycle Time | Short |
| Key Features | Descriptions |
|---|---|
| Fully Automatic Molding System | This molding equipment is equipped with a fully automatic system, allowing for efficient and convenient operation. |
| Automatic Molding Machine | This machine can automatically carry out the molding process, saving time and effort for the user. |
| Automatic Molding Machine | This molding equipment is specifically designed for use in the semiconductor industry, ensuring high precision results. |
【Product Detail】
● Semiconductor packaging equipment is also known as chip packaging equipment and IC packaging equipment, semiconductor MOLDING packaging equipment;
● Automatic packaging test chip, semiconductor device, IC and other products;
● Full servo control system, PLC (Omron)+upper machine;
● Win10+15 -inch touch screen+touch keyboard;
● CCD image detection, feeding anti -counter -detection;
● Standardized mold structure, convenient replacement;
Our Semiconductor Molding Equipment is carefully packaged to ensure safe and secure delivery to our customers. Depending on the size and weight of the equipment, it will be packaged in either wooden crates or heavy-duty cardboard boxes.
All electronic components are protected with anti-static packaging materials to prevent any potential damage during shipping. The equipment is also secured with foam padding and bubble wrap to further cushion it during transport.
For international shipping, we use a combination of air and sea freight to deliver our products to our customers. Each shipment is carefully tracked and monitored to ensure timely delivery and to provide our customers with updates on the status of their order.
Upon arrival at the destination, our customers will be responsible for any customs clearance procedures and fees. We will provide all necessary documentation to assist with the process.
If there are any special packaging or shipping requests, please inform us at the time of purchase so that we can accommodate your needs.
Thank you for choosing our Semiconductor Molding Equipment. We strive to provide the best packaging and shipping service to ensure your complete satisfaction.
