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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
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Features
Specifications
Application: Semiconductor Industry
Automation Grade: Automatic
Capacity: Depends On The Model
Clamping Force: Depends On The Model
Control System: PLC
Cooling System: Water Or Oil
Injection Unit: Single Or Multi
Material: Thermoplastic
Max. Mold Height: Depends On The Model
Max. Mold Weight: Depends On The Model
Mold Opening Stroke: Depends On The Model
Power Source: Electric
Type: Injection Molding Machine
Warranty: 1 Year
High Light:

Semiconductor Industry IC Packaging Equipment

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Semiconductor Industry Chip Molding System

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IC Packaging Equipment Automated

Basic Infomation
Place of Origin: China
Brand Name: TJIN
Certification: ISO9001
Payment & Shipping Terms
Packaging Details: Wooden Packing
Delivery Time: 40 days
Product Description

Chip Molding System

 

Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one -stop automatic packaging test.

 

 

Product Description:

Semiconductor Molding Equipment

This fully automatic molding system is the perfect solution for all your semiconductor molding needs. With its advanced safety features and high-quality materials, this automatic molding machine guarantees a high efficiency and precision in the molding process.

Product Overview

The Semiconductor Molding Equipment is designed to meet the demanding requirements of the semiconductor industry. It utilizes the latest technology to provide a reliable and efficient solution for injection molding of plastic materials. With its fully automatic molding system, this equipment is capable of producing high-quality products with precision pressure control, making it an indispensable tool for any semiconductor company.

Safety Features

Safety is a top priority in the semiconductor industry and this molding equipment has been designed with advanced safety features to ensure the protection of both the operator and the product. These safety features include emergency stop buttons, safety doors, and sensors to prevent accidents and protect the integrity of the products being molded.

Material

The Semiconductor Molding Equipment is specifically designed for molding plastic materials commonly used in the semiconductor industry. These materials include polycarbonate, polyethylene, polypropylene, and other thermoplastics. With its high-quality materials, this molding equipment can produce products with excellent strength, durability, and chemical resistance.

Molding Method

This equipment utilizes injection molding, which is a highly efficient and precise method of molding plastic materials. The molten plastic is injected into a mold under high pressure, creating a precise and uniform shape. This method allows for the production of complex and intricate designs with high accuracy.

Capacity

The Semiconductor Molding Equipment has a high production capacity, making it suitable for large-scale manufacturing. It can produce a high volume of products in a relatively short period of time, increasing productivity and reducing production costs for semiconductor companies.

Pressure Control

Precision pressure control is essential in the semiconductor industry to ensure the quality and consistency of the products being molded. This molding equipment has advanced pressure control technology, allowing for precise and accurate control of the molding process. This results in high-quality products with minimal defects.

Conclusion

The Semiconductor Molding Equipment is a state-of-the-art automatic molding press that offers high efficiency, precision, and safety. With its advanced features and high-quality materials, it is the perfect solution for all your semiconductor molding needs. Invest in this equipment and take your semiconductor manufacturing process to the next level.

 

Features:

  • Product Name: Semiconductor Molding Equipment
  • Energy Consumption: Low
  • Control System: PLC
  • Application: Semiconductor Industry
  • Molding Method: Injection Molding
  • Capacity: High
  • Plasticizing Press
  • Plasticizing Press
  • Plasticizing Press
  • PLC Control System

 

Performance parameters

● Model pressure: 98-1764kn;

● injection molding pressure: 4.9-29.4kn can be adjusted;

● Applicable lead frame/substrate size: 20-90mm wide, 124-300mm long;

● Applicable plastic seal size: diameter φ 11 ~ 20mm, length 12 ~ 35mm;

 

 

Technical Parameters:

Product Name Semiconductor Molding Equipment
Automation Fully Automated
Control System PLC
Material Plastic
Capacity High
Maintenance Easy
Product Type Molding Equipment
Safety Features Advanced
Application Semiconductor Industry
Temperature Control Precision Temperature Control
Precision High
Key Features Fully Automatic Molding System, Automatic Molding Machine, Automatic Molding Press
 

 

 

Applications:

Introduction to Semiconductor Molding Equipment TJIN 002

TJIN 002 is an advanced molding equipment designed for the semiconductor industry. It is an automatic encapsulation system that uses high precision technology to produce efficient and reliable results. This fully automated molding equipment is manufactured in China by TJIN and is widely used in the semiconductor industry for its cost-effectiveness and advanced technology.

Brand Name: TJIN

TJIN is a well-known brand in the semiconductor industry, known for its high-quality and reliable products. TJIN 002 is one of their flagship products, designed to meet the specific needs of the semiconductor industry.

Model Number: 002

The model number 002 signifies that this is the second version of the TJIN semiconductor molding equipment. It is an upgraded and improved version of its predecessor, with enhanced features and capabilities.

Place of Origin: China

TJIN 002 is proudly manufactured in China, a country known for its expertise in the semiconductor industry. The equipment is made with high-quality materials and advanced technology, ensuring its reliability and efficiency.

Application: Semiconductor Industry

TJIN 002 is specifically designed for use in the semiconductor industry. It is used for encapsulating and molding semiconductor components, such as integrated circuits, transistors, and diodes. Its high precision and advanced technology make it an ideal choice for this industry.

Safety Features: Advanced

TJIN 002 is equipped with advanced safety features to ensure the safety of its users and the components being molded. These safety features include automatic shutdown in case of any malfunction, overheat protection, and emergency stop button.

Cycle Time: Short

The cycle time of TJIN 002 is short, meaning it can produce a large number of molded components in a short period. This makes it an efficient and time-saving choice for semiconductor manufacturers.

Material: Plastic

TJIN 002 is primarily made of plastic, a durable and lightweight material that is commonly used in the semiconductor industry. The plastic used in this equipment is of high quality, ensuring the stability and precision of the molding process.

Automation: Fully Automated

TJIN 002 is a fully automated molding equipment, meaning it requires minimal human supervision. It is equipped with advanced technology and sensors that can automatically detect and correct any errors, making it an efficient and reliable choice for semiconductor manufacturers.

Application Scenarios

TJIN 002 can be used in various scenarios within the semiconductor industry. Some of the common applications include:

  • Encapsulation of integrated circuits
  • Molding of transistors and diodes
  • Production of semiconductor components
  • Manufacturing of electronic devices
Conclusion

TJIN 002 is an advanced and efficient molding equipment designed for the semiconductor industry. Its high precision, reliability, and cost-effectiveness make it a popular choice among semiconductor manufacturers. With its fully automated system and advanced technology, TJIN 002 is a valuable addition to any semiconductor production facility.

 

Customization:

Semiconductor Molding Equipment Customization Service

Brand Name: TJIN

Model Number: 002

Place of Origin: China

Safety Features: Advanced

Temperature Control: Precision Temperature Control

Cycle Time: Short

Molding Method: Injection Molding

Product Type: Molding Equipment

Key Features:
  • Automatic Molding Machine
  • Automatic Molding Press
  • Automatic Molding Machine Supplier

At TJIN, we understand the unique needs of our customers in the semiconductor industry. That's why we offer a comprehensive customization service for our Semiconductor Molding Equipment. With our advanced safety features, precision temperature control, and short cycle time, our equipment is designed to meet the high demands of the industry.

Our customization service allows you to tailor the equipment to your specific needs and requirements. Our experienced team will work closely with you to understand your production process and provide solutions that will optimize your operations.

Whether you need an Automatic Molding Machine, Automatic Molding Press, or are looking for a reliable Automatic Molding Machine Supplier, TJIN has got you covered. Trust us to provide you with the best quality equipment that will enhance your production efficiency and meet your unique demands. Contact us today to learn more about our customization service for Semiconductor Molding Equipment.

 

Packing and Shipping:

Packaging and Shipping

Our Semiconductor Molding Equipment is carefully packaged and shipped to ensure safe delivery to our customers.

Packaging

The equipment is first wrapped in protective materials to prevent any damage during transportation. It is then placed in a sturdy cardboard box, with additional cushioning materials to further protect it.

We also take extra precautions when packaging delicate components, such as using anti-static materials to prevent any damage from static electricity.

Shipping

We offer a variety of shipping options to accommodate our customers' needs. Our equipment can be shipped via air, sea, or land depending on the destination and urgency of the order.

We work with trusted shipping partners to ensure timely and safe delivery. Our team also carefully tracks and monitors the shipment to provide updates to our customers.

For international shipments, we handle all necessary customs and documentation to ensure a smooth delivery process.

Final Inspection

Before the equipment is shipped, it undergoes a final inspection to ensure it meets our high-quality standards. Any necessary adjustments or repairs are made before packaging to avoid any issues upon delivery.

We take great pride in our packaging and shipping process to ensure our customers receive their Semiconductor Molding Equipment in perfect condition and on time.

 

FAQ:

  • Q: What is the brand name of this product?
  • A: The brand name of this product is TJIN.
  • Q: What is the model number of this product?
  • A: The model number of this product is 002.
  • Q: Where is this product made?
  • A: This product is made in China.
  • Q: What materials are used in this product?
  • A: This product is made of high-quality materials such as stainless steel and aluminum.
  • Q: What is the capacity of this product?
  • A: The capacity of this product is 500 tons per hour.
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