Water Cooling IC Lead Frame Stamping Mold with Single Cavity and ±0.01mm Tolerance
The IC Lead Frame Stamping Mold is a high-quality mold used in the production of semiconductors. It is specifically designed for the precise and efficient stamping process of lead frames. With its advanced features and surface treatment, this mold is an essential tool for the production of high-quality IC lead frames.
The IC Lead Frame Stamping Mold is coated with nickel plating, which provides a smooth and durable surface. This surface treatment ensures that the mold can withstand the high heat and pressure of the stamping process without any damage, resulting in consistent and precise lead frame production.
The mold base of the IC Lead Frame Stamping Mold is customizable and can be made from various high-quality materials such as LKM, DME, HASCO, and more. This allows for flexibility in the production process and ensures that the mold can meet the specific requirements of different semiconductor manufacturers.
The IC Lead Frame Stamping Mold has a single cavity, which means it can produce one lead frame at a time. This allows for better control and precision in the stamping process, resulting in high-quality lead frames with minimal defects.
This mold is equipped with a water cooling system to maintain a consistent temperature during the stamping process. The water helps to dissipate the heat generated by the stamping process, ensuring that the mold remains at an optimal temperature for efficient production.
With our efficient production process and advanced technology, we are able to deliver the IC Lead Frame Stamping Mold in 4-6 weeks. We understand the importance of timely delivery in the semiconductor industry and strive to meet the demands of our customers.
In conclusion, the IC Lead Frame Stamping Mold is a high-quality and essential tool for the production of semiconductors. With its advanced features, including nickel plating, customizable mold base, single cavity, water cooling system, and fast lead time, this mold ensures efficient and precise stamping of lead frames for superior quality ICs.
Brand Name: TJIN
Model Number: 006
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Mold Cooling System: Water Cooling
Material: Steel
Hardness: HRC 50-60
Application: IC Lead Frame Stamping
Mold Design: 3D/2D
The TJIN IC Lead Frame Stamping Mold is a high-quality and high-precision mold designed specifically for IC lead frame stamping. It is made from durable steel material with a hardness of HRC 50-60, ensuring long-lasting use and consistent results. The mold is ISO9001 certified, guaranteeing its excellent quality and performance.
The mold is equipped with an advanced water cooling system, allowing for efficient and precise cooling during the stamping process. This results in a higher production rate and better quality finished products.
The TJIN IC Lead Frame Stamping Mold is designed using the latest 3D/2D technology, allowing for customizable designs to meet the specific needs of each customer. This ensures that the mold is tailored to the exact specifications of the desired IC lead frame, resulting in a perfect fit every time.
The mold is designed with high precision, ensuring that each IC lead frame is stamped accurately and with consistent quality. This results in a higher success rate and less waste, saving time and cost for the user.
We understand the importance of time in the manufacturing industry. That is why we offer a fast delivery time of 40 days for our TJIN IC Lead Frame Stamping Mold. This allows our customers to meet their production deadlines and stay ahead of their competitors.
The TJIN IC Lead Frame Stamping Mold is a top choice for manufacturers looking for a high-quality, high-precision, and customizable mold. With its advanced water cooling system, durable steel material, and fast delivery time, it is the perfect solution for all IC lead frame stamping needs. Trust TJIN for all your IC lead frame mold needs and experience the difference in quality and efficiency.
At TJIN, we specialize in providing high-quality lead frame molds for semicon ICs. Our IC Lead Frame Stamping Mold (Model Number: 006) is customized to meet your specific needs and requirements. Made in China, our molds are ISO9001 certified and guarantee superior performance and durability.
With a minimum order quantity of just 1, we offer flexible options for our customers. Our molds are carefully packaged in wooden packaging to ensure safe delivery. The delivery time for our customized molds is 40 days, and we accept TT as our payment terms.
The hardness of our molds ranges from HRC 50-60, making them suitable for high-precision stamping. We use top-quality mold materials such as NAK80, S136, and SKD61, ensuring long-lasting and reliable performance.
Our IC Lead Frame Stamping Mold has a single cavity number, making it perfect for producing one lead frame at a time. The mold is made of sturdy steel, providing excellent stability and precision during the stamping process. We use standard mold bases such as LKM, DME, and HASCO, ensuring compatibility with various machines and equipment.
Choose TJIN for your lead frame mold customization needs. We guarantee superior quality, prompt delivery, and excellent customer service. Contact us now to learn more about our customization options.
The IC Lead Frame Stamping Mold is carefully packaged to ensure safe and secure delivery to our customers. The packaging process follows strict guidelines to protect the mold from any damage during shipping.
We offer various shipping methods to accommodate our customers' needs:
All shipments are insured to ensure that our customers receive their mold in perfect condition.
For larger orders or special shipping requests, please contact our customer service team for assistance.
Thank you for choosing our IC Lead Frame Stamping Mold. We strive to provide the best packaging and shipping services to ensure your satisfaction.
