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Phone Number :	+86 13450030904
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Keywords [ semicon molding equipment ] match 22 Products.

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface
Application	Metal Trimming And Forming
Compatibility	Fits With Various Machines
Durability	Long-lasting
Hardness	HRC 58-62

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

MOQ: 1 set

Application	Industrial
Color	Silver
Compatibility	Fits Most Casting Machines
Durability	High
Material	Aluminum

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

MOQ: 1

Mold Type	Stamping Mold
Material	Steel
Application	IC Lead Frame Stamping
Mold Cooling System	Water Cooling
Mold Design	3D/2D

Non Normal Standard Custom Metal Stamping Mold For Integrated Circuit

MOQ: 1 set

Application	Integrated Circuit Manufacturing
Compatibility	Various IC Sizes
Cost Efficiency	High
Dimension	Customized
Durability	Long-lasting

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

MOQ: 1

Mold Cooling System	Water Cooling
Tolerance	±0.01mm
Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks

Lead Frame Semiconductor Molding

MOQ: 1 set

Accuracy	High
Application	IC Lead Frame Production
Cavity	Single
Cooling System	Water Cooling
Dimension	Customized

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Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

MOQ: 1 set

Control System	PLC + HMI
Cooling System	Water Cooling
Forming Material	PVC, PET, PP, PS, Etc.
Forming Speed	10-20 Cycles/min
Heating System	Infrared Ceramic Heater

Auto Frame Loader semicon equipment

MOQ: 1 set

Air Consumption	100L/min
Air Pressure	0.5-0.7MPa
Control System	PLC
Dimensions	1200mm X 1200mm X 1500mm
Forming Speed	3000-4000pcs/hour

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

MOQ: 1

Compatibility	Suitable For Various Machines
Size	Customized
Precision	High
Application	Metal Trimming And Forming
Shape	Round

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

MOQ: 1 set

Air Pressure	0.5MPa
Air Consumption	Approx. 100L/min
Control System	PLC Control System
Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm
Trimming Speed	Approx. 0.5 Seconds Per Piece

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semicon molding equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

Non Normal Standard Custom Metal Stamping Mold For Integrated Circuit

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

Lead Frame Semiconductor Molding

Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Auto Frame Loader semicon equipment

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply