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Phone Number :	+86 13450030904
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Keywords [ semiconductor mold ] match 153 Products.

Auto CAD Designed MGP Mold With Pin Point Gate For High Efficiency Mirror Polishing

MOQ: 1

Design Software	UG, ProE, Solidworks, AutoCAD
Surface Treatment	Mirror Polishing
Ejection System	Ejector Pin, Ejector Sleeve, Ejector Blade, Etc.
Material	High-quality Steel
Mold Base	LKM, DME, HASCO Or Customized

Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing

MOQ: 1 set

Application	Manufacturing
Cavity	Single Or Multiple
Compatibility	Wide Range Of Materials
Cost	Competitive
Cycle Time	Short

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

MOQ: 1 set

Application	Injection Molding
Cavity	Single/Multi
Ejection Type	Ejector Pin/Ejector Sleeve
Lead Time	4-8 Weeks
Material	Steel

Highly Efficient Semiconductor Packaging Equipment

MOQ: 1 set

Application	Semiconductor Industry
Automation	Fully Automatic
Capacity	Depends On Model
Clamping Force	Depends On Model
Control System	PLC

VIDEO

Chip Transfer Molding Semiconductor Manufacturing Equipment Water Cooling

MOQ: 1 set

Application	Semiconductor Industry
Capacity	100 Tons
Clamping Force	1000 KN
Control System	PLC
Cooling System	Water Cooling

VIDEO

Auto Plasticizing Press Semiconductor Chip Manufacturing Machines ISO9001 Certified

MOQ: 1 set

Application	Semiconductor Industry
Automation	Fully Automatic
Capacity	1000 Tons
Control System	PLC
Cooling System	Water

VIDEO

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

MOQ: 1 set

Application	Semiconductor Industry
Automation Grade	Automatic
Capacity	Depends On The Model
Clamping Force	Depends On The Model
Control System	PLC

VIDEO

Full Auto Semiconductor Production Equipment For Injection Molding

MOQ: 1 set

Accuracy	High
Application	Semiconductor Manufacturing
Automation Level	Fully Automated
Capacity	High
Clamping Force	High

High Performance Molding Process Semiconductor Manufacturing Machine Automated

MOQ: 1 set

Cycle Time	Short
Safety Features	Advanced
Material	Plastic
Automation	Fully Automated
Molding Method	Injection Molding

Plasticizing Press Semiconductor Production Equipment For Injection Molding

MOQ: 1 set

Application	Semiconductor Industry
Capacity	1000 Tons
Clamping Force	1000 Tons
Control System	PLC Control
Injection Speed	1000 Mm/s

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor mold

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Auto CAD Designed MGP Mold With Pin Point Gate For High Efficiency Mirror Polishing

Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

Highly Efficient Semiconductor Packaging Equipment

Chip Transfer Molding Semiconductor Manufacturing Equipment Water Cooling

Auto Plasticizing Press Semiconductor Chip Manufacturing Machines ISO9001 Certified

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Full Auto Semiconductor Production Equipment For Injection Molding

High Performance Molding Process Semiconductor Manufacturing Machine Automated

Plasticizing Press Semiconductor Production Equipment For Injection Molding