| IC Lead Frame Stamping Mold Technical Parameters | |
|---|---|
| Mold Life | 100,000 Shots |
| Mold Cooling System | Water Cooling |
| Application | IC Lead Frame Stamping |
| Surface Treatment | Nickel Plating |
| Lead Time | 4-6 Weeks |
| Runner System | Hot Runner/Cold Runner |
| Mold Material | NAK80, S136, SKD61, Etc. |
| Cavity Number | Single |
| Mold Type | Stamping Mold |
| Mold Base | LKM, DME, HASCO, Etc. |
| IC Lead Frame Stamping Mold Features | |
|---|---|
| Hige-Quality Lead Frame Mold | This mold is made with high-quality materials and precision manufacturing techniques to ensure the best performance and longevity. |
| Semicon IC Lead Frame Mold | Specifically designed for the production of semiconductor IC lead frames, this mold provides high precision and efficiency. |
| Lead Frame Mold | This mold is designed to create lead frames for electronic components, making it an essential tool in the electronics industry. |
| IC Lead Frame Stamping Mold | The stamping process allows for high-speed and high-volume production of IC lead frames, making this mold ideal for mass production. |
The IC Lead Frame Stamping Mold, manufactured by TJIN, is a high-quality and precision mold designed for the production of lead frames for integrated circuits. It is widely used in the electronics industry, particularly in the manufacturing of semiconductors.
The lead frame is an essential component in the production of integrated circuits as it provides a platform for the electronic components to be mounted and connected. The IC Lead Frame Stamping Mold plays a crucial role in creating the lead frame with high precision and accuracy, ensuring the proper functioning of the integrated circuit.
With its 3D/2D mold design, the IC Lead Frame Stamping Mold allows for the customization of the lead frame size and shape, catering to the specific needs of different integrated circuits. The mold design also ensures the production of a single cavity, providing a consistent and uniform lead frame for efficient and reliable integrated circuit production.
Brand Name: TJIN
Model Number: 006
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Application: IC Lead Frame Stamping
Runner System: Hot Runner/Cold Runner
Cavity Number: Single
Tolerance: ±0.01mm
Mold Cooling System: Water Cooling
Hige-Quality Lead Frame Mold
Semicon IC Lead Frame Mold
Thank you for choosing our IC Lead Frame Stamping Mold! We are committed to providing you with high-quality products and excellent service.
Our IC Lead Frame Stamping Mold will be carefully packaged to ensure its safe delivery to you. The packaging will include:
These materials will protect the mold from any damage during transit.
We offer several shipping options to meet your needs:
Once your order is processed, you will receive a tracking number via email to track your shipment.
Please note that shipping costs may vary depending on the shipping method and your location.
For international orders, please be aware that customs and duties may apply. These fees are the responsibility of the customer and are not included in the product price or shipping cost.
If you have any questions or concerns about the packaging or shipping of our IC Lead Frame Stamping Mold, please don't hesitate to contact us. Thank you again for choosing our product.
Main packaging form
To series: T0220/263/247/252/3p, etc.;
SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;;
DIP series: DIP4/8/14/16/18/23/24/25/29/40;
SOT series: SOT23/25/26/223/89;;
SOD series: S0D123/323/523/723/923;
QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.;
Technical Parameters
1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design;
2. Cavity Bar uses high-speed powder steel, hardness HRC62-64;
3. Surface vacuum coating, the life span is not less than 300,000 times;
4. The roughness of the cavity can achieve 0.2um.max;
5. Special products can increase the design of vacuum and built -in core pumping mechanisms;
6. According to the size of different lead frames, 8 tablets/12 pieces/16 tablets per mold can be achieved.
