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Phone Number :	+86 13450030904
WhatsApp :	+8613450030904

Keywords [ semiconductor packaging equipment ] match 148 Products.

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

MOQ: 1 set

After-Sales Service	Lifetime Maintenance
Application	Injection Molding
Cavity	Single Or Multi
Design Software	UG, ProE, Solidworks, AutoCAD
Ejection System	Ejector Pin, Ejector Plate, Air Ejector

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

MOQ: 1

Mold Type	Stamping Mold
Material	Steel
Application	IC Lead Frame Stamping
Mold Cooling System	Water Cooling
Mold Design	3D/2D

IC Scheduler Chip Sorting Machine

MOQ: 1 set

Application	Semiconductor Industry
Certifications	CE, ISO9001
Dimensions	1200mm X 800mm X 1500mm
Input Capacity	Up To 5000 Chips
Model	CSM-300

15 Channels Chip Sorter Machine

MOQ: 1

Sorting Speed	Up To 500 Chips Per Minute
Material	Stainless Steel
Model	CSM-15
Air Consumption	0.1m³/min
Weight	500kg

Customized Size IC Lead Frame Stamping Mold With Nickel Plating

MOQ: 1

Hardness	HRC 50-60
Tolerance	±0.01mm
Mold Design	3D/2D
Application	IC Lead Frame Stamping
Surface Treatment	Nickel Plating

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

MOQ: 1 set

Application	Injection Molding
Cavity	Single Or Multi-cavity
Cooling System	Water Or Oil Cooling
Ejection Type	Ejector Pin, Ejector Sleeve, Or Air Poppet
Gate Type	Edge Gate, Pin Point Gate, Or Sub Gate

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection

MOQ: 1

Mold Life	500,000 Shots Or More
Runner System	Hot Runner Or Cold Runner
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Mold Base	LKM, DME, HASCO Or Customized
Mold Standard	DME, HASCO, LKM Or Customized

VIDEO

Automatically Trim And Form Machine Bar Cutting Forming Separating System

MOQ: 1 set

Packaging Details	Wooden Packing
Delivery Time	40 days
Place of Origin	China
Brand Name	TJIN
Certification	ISO9001

High Accuracy Automatically Wafer Sorting Machine Easy Operation

MOQ: 1 set

Capacity	1000 Chips Per Minute
Color	Silver
Control System	PLC
Dimensions	1200mm X 800mm X 1500mm
Interface	Touch Screen

Optical Sensor Chip Sorter Machine Semicon Sorting Device Easy Operation

MOQ: 1 set

Capacity	100 Chips Per Minute
Communication Interface	Ethernet
Dimensions	1200mm X 800mm X 1500mm
Display	Touch Screen
Material	Stainless Steel

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

tjin@taijinbdt.com

+86 13450030904

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor packaging equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Single Or Multi Cavity MGP Molding Tool Mirror Polished QFN Series

Hot Runner System Semicon IC Lead Frame Mold For High Precision Tolerance

IC Scheduler Chip Sorting Machine

15 Channels Chip Sorter Machine

Customized Size IC Lead Frame Stamping Mold With Nickel Plating

DIP Series Of Plastic Seal MGP Mold Tooling With Chrome Plating

Superior Performance Steel MGP Mold With Ejector Pin For Smooth Ejection

Automatically Trim And Form Machine Bar Cutting Forming Separating System

High Accuracy Automatically Wafer Sorting Machine Easy Operation

Optical Sensor Chip Sorter Machine Semicon Sorting Device Easy Operation