Buy semiconductor packaging equipment, Good quality semiconductor packaging equipment manufacturer

All Products

I'm Online Chat Now

Contact Person :	Zhao
Phone Number :	+86 13450030904
WhatsApp :	+8613450030904

Keywords [ semiconductor packaging equipment ] match 148 Products.

Edge Gate High Precision MGP Semiconductor Mold For HASCO Standard Reliability

MOQ: 1

Design Software	UG, ProE, Solidworks, AutoCAD
Mold Base	LKM, DME, HASCO Or Customized
Quality Control	ISO9001:2015, SGS, ROHS
Cavity	Single Or Multi
Material	High-quality Steel

PLC Control IC Chip Molding Machine

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC
Ejector Stroke	300 Mm
Injection Pressure	200 MPa

Semiconductor MGP Mold Mirror Polishing And Ejector Sleeve For High Performance

MOQ: 1

Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Cavity	Single Or Multi
Mold Base	LKM, DME, HASCO Or Customized
Mold Life	500,000 Shots Or More
Mold Standard	DME, HASCO, LKM Or Customized

Automatic Semiconductor Molding Press Machine

MOQ: 1 set

Capacity	1000 Units/hour
Control System	PLC
Cooling System	Water Cooling
Dimensions	2000mm X 1500mm X 1800mm
Heating Power	10 KW

VIDEO

Auto Trim Form Machine Semiconductor Making Machine High Precision

MOQ: 1 set

Control System	PLC
Dimensions	1200mm X 800mm X 1500mm
Forming Speed	3000pcs/hour
Max. Board Size	400mm X 300mm
Max. Board Thickness	2mm

VIDEO

Trim And Form Process Semiconductor Fabrication Machines 500W

MOQ: 1 set

Accuracy	±0.01mm
Control System	PLC
Dimensions	L 1000mm X W 500mm X H 800mm
Forming Method	Mechanical
Material	Stainless Steel

Semiconductors Trim And Form Machine

MOQ: 1 set

Name	Trim And Form Machine
Forming Method	Pneumatic Press
Operating Interface	Touch Screen
Power Supply	AC 220V, 50/60Hz
Trimming Method	Rotary Cutter

Automated IC Manufacturing Equipment Semiconductor Laminator High Accuracy

MOQ: 1 set

Capacity	1000 Chips Per Minute
Color	Silver
Dimensions	1200mm X 800mm X 1500mm
Material	Stainless Steel
Model	CSM-100

Customized Semiconductor Chip Sorting Machine Auto Discharge Sequence Equipment

MOQ: 1 set

Communication Interface	USB
Dimensions	800mm600mm1200mm
Display	LCD Touch Screen
Power	220V/50Hz
Sorting Accuracy	99.9%

Lightweight SOT23 MGP Semiconductor Mould Customization Low Maintenance

MOQ: 1 set

Compatibility	Universal
Compatibility With Different Materials	Yes
Cost-effectiveness	Affordable
Customization Options	Extensive
Design	Sleek

< Previous 5 6 7 8 9 Next > Last Total 15 page

Get In Touch

No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

tjin@taijinbdt.com

+86 13450030904

About

Company Profile Factory Tour Quality Control Contact Us

Products

Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

Mail Us

Let us know your requirement. We will connect best products with you.

semiconductor packaging equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Edge Gate High Precision MGP Semiconductor Mold For HASCO Standard Reliability

PLC Control IC Chip Molding Machine

Semiconductor MGP Mold Mirror Polishing And Ejector Sleeve For High Performance

Automatic Semiconductor Molding Press Machine

Auto Trim Form Machine Semiconductor Making Machine High Precision

Trim And Form Process Semiconductor Fabrication Machines 500W

Semiconductors Trim And Form Machine

Automated IC Manufacturing Equipment Semiconductor Laminator High Accuracy

Customized Semiconductor Chip Sorting Machine Auto Discharge Sequence Equipment

Lightweight SOT23 MGP Semiconductor Mould Customization Low Maintenance