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Keywords [ semiconductor packaging equipment ] match 148 Products.

Fully Automatic Efficient Semiconductor Molding System Semiconductor Machine Maker

MOQ: 1 set

Capacity	100 Tons
Clamping Force	150 Tons
Control System	PLC
Cooling System	Water
Dimensions	2000 X 1500 X 3000 Mm

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC Control
Ejector Force	50 KN
Ejector Stroke	300 Mm

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

MOQ: 1 set

Control System	PLC
Cooling System	Water Cooling
Dimensions	2000x1500x2500 Mm
Heating Power	10 KW
Injection Pressure	200 MPa

Compact Chip Sorting Machine Automatic Laminating For Semiconductor Industry

MOQ: 1 set

Application	Semiconductor Industry
Communication Interface	Ethernet
Dimensions	1200mm X 800mm X 1500mm
Model	CSM-100
Operating System	Windows 10

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

MOQ: 1 set

Air Pressure	0.5MPa
Air Consumption	Approx. 100L/min
Control System	PLC Control System
Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm
Trimming Speed	Approx. 0.5 Seconds Per Piece

Semiconductor Industry IC Chip Sorting Machine Highly Efficient

MOQ: 1

Air Consumption	0.1m³/min
Capacity	Up To 15,000 Chips Per Hour
Sorting Speed	Up To 500 Chips Per Minute
Air Pressure	0.6-0.8MPa
Sorting Accuracy	99.9%

ProE Design Software Chip Packaging MGP Mold With ISO9001 2015 Control Certification

MOQ: 1

Mold Life	500,000 Shots Or More
Gate Type	Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Ejection System	Ejector Pin, Ejector Sleeve, Ejector Blade, Etc.
Mold Weight	50kg-10 Tons
Quality Control	ISO9001:2015, SGS, ROHS

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

MOQ: 1

Mold Cooling System	Water Cooling
Tolerance	±0.01mm
Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

MOQ: 1

Compatibility	Suitable For Various Machines
Resistance	Corrosion And Wear
Shape	Round
Usage	Industrial
Size	Customized

8 Channels Wafer Sorter Machine Ic Manufacturing Equipment AC220V

MOQ: 1 set

Application	Semiconductor Industry
Control System	PLC Control
Dimensions	1500mm X 1200mm X 1800mm
Power Supply	AC 220V, 50/60Hz
Product Type	Automatic Sorting Machine

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semiconductor packaging equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Fully Automatic Efficient Semiconductor Molding System Semiconductor Machine Maker

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

Compact Chip Sorting Machine Automatic Laminating For Semiconductor Industry

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

Semiconductor Industry IC Chip Sorting Machine Highly Efficient

ProE Design Software Chip Packaging MGP Mold With ISO9001 2015 Control Certification

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

8 Channels Wafer Sorter Machine Ic Manufacturing Equipment AC220V