Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | High |
Control System | PLC |
Cooling System | Water Cooling |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | 1000 Tons |
Clamping Force | 1000 KN |
Control System | PLC |
Capacity | 1000 Chips Per Minute |
---|---|
Communication | Ethernet |
Dimensions | 1200mm X 800mm X 1500mm |
Interface | Touch Screen |
Material | Stainless Steel |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 10000 KN |
Control System | PLC |
Cooling System | Water Cooling |
Platen Size | 600 X 600 Mm |
---|---|
Clamping Force | 1000 KN |
Max. Mold Height | 400 Mm |
Cooling System | Water |
Model | SM-1000 |
Accuracy | High |
---|---|
Application | Semiconductor Manufacturing |
Automation Level | Fully Automated |
Capacity | High |
Clamping Force | High |
Control System | PLC |
---|---|
Application | Semiconductor Industry |
Product Type | Molding Equipment |
Cycle Time | Short |
Automation | Fully Automated |
Control System | PLC |
---|---|
Temperature Control | Precision Temperature Control |
Product Type | Molding Equipment |
Automation | Fully Automated |
Molding Method | Injection Molding |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | Depends On Model |
Clamping Force | Depends On Model |
Control System | PLC |
Application | Semiconductor Manufacturing |
---|---|
Capacity | 1000 Tons |
Control System | PLC |
Frequency | 50Hz |
Injection Pressure | 200 MPa |