High Durability Semiconductor Molding Machine Automated ISO9001 Approval

^{Automatic Molding Machine}

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

FAQ:

• Q: What is the brand name of this product?
• A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
• A: The model number of this product is 001.
• Q: Where is this product made?
• A: This product is made in China.
• Q: Does this product have any certifications?
• A: Yes, this product is ISO9001 certified.
• Q: What is the minimum order quantity for this product?
• A: The minimum order quantity for this product is 1.
• Q: How is this product packaged?
• A: This product is packaged in wooden packaging.
• Q: What is the estimated delivery time for this product?
• A: The estimated delivery time for this product is 40 days.
• Q: What are the payment terms for this product?
• A: The payment terms for this product are TT (Telegraphic Transfer).

Technical Parameters:

Product Details:

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● Automatic cassette loading, double cassette stacked loading;

● Supports flexible expansion of up to 4 groups of presses to realize high UPH;

● Equipped with vision system to recognize the feeding direction;

● WIN10 + 15 inch touch screen + touch keyboard;

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;