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Automatic Semiconductor Molding Press Machine

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Automatic Semiconductor Molding Press Machine
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Features
Specifications
Capacity: 1000 Units/hour
Control System: PLC
Cooling System: Water Cooling
Dimensions: 2000mm X 1500mm X 1800mm
Heating Power: 10 KW
Injection Pressure: 200 MPa
Injection Speed: 200 Mm/s
Injection Volume: 1000 Cc
Material Compatibility: Silicone, Epoxy, Polyurethane
Model: SM-1000
Mold Clamping Force: 100 Tons
Operating Temperature: 150-200℃
Power Supply: 220V/50Hz
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Semiconductor Molding Press Machine

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Molding Press semiconductor equipment

Basic Infomation
Place of Origin: China
Brand Name: TJIN
Certification: ISO9001
Payment & Shipping Terms
Packaging Details: Wooden Packing
Delivery Time: 40 days
Product Description

Automatic Molding Press Machine

 

Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

● WIN10 + 15 inch touch screen + touch keyboard;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

 

Technical Parameters:

Type Vertical Injection Molding Machine
Control System PLC
Model SM-1000
Cooling System Water
Weight 5 Tons
Clamping Force 1000KN
Capacity 100 Tons
Screw Diameter 35 Mm
Max. Mold Height 400Mm
Injection Pressure 200 Mpa
Auto Transfer Molding Yes
Auto Packaging Equipment Yes
 

 

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

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Tel : +86 13450030904
Fax : 86-769-81761210
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