Injection Pressure 200 MPa Auto Transfer Molding with 35 Mm Screw Diameter
The Semiconductor Molding Machine, model SM-1000, is a state-of-the-art product designed for the manufacturing of semiconductor products. It is equipped with advanced features and cutting-edge technology to provide high precision and efficiency in the molding process.
The machine has a clamping force of 1000 KN, which ensures a strong and stable grip on the mold during the molding process. This helps in producing high-quality and consistent products.
The screw diameter of this machine is 35 mm, making it suitable for various sizes of molds. This allows for flexibility in the production process and the ability to cater to different customer requirements.
The model SM-1000 is a single injection unit machine, which means it is designed to perform one injection at a time. This helps in maintaining accuracy and consistency in the molding process.
The Semiconductor Molding Machine has a weight of 5 tons, making it a sturdy and durable machine. It is designed with high-quality materials to ensure a long lifespan and minimal maintenance requirements.
In addition to the molding process, this machine also comes equipped with auto packaging equipment. This feature allows for automatic packaging of the finished products, saving time and labor costs.
The SM-1000 is designed to provide high precision and efficiency in the molding process. With its advanced technology and features, it can produce consistent and high-quality products in a short amount of time, making it a cost-effective solution for semiconductor manufacturers.
The Semiconductor Molding Machine - SM-1000 is a top-of-the-line product that offers high precision, efficiency, and flexibility in the manufacturing of semiconductor products. With its advanced features and cutting-edge technology, it is a must-have for any semiconductor manufacturing facility.
Max. Mold Height: | 400 mm |
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Clamping Force: | 1000 kN |
Injection Pressure: | 200 MPa |
Screw Diameter: | 35 mm |
Cooling System: | Water |
Control System: | PLC |
Type: | Vertical Injection Molding Machine |
Heating Power: | 12 kW |
Platen Size: | 600 x 600 mm |
Capacity: | 100 tons |
Auto Packaging Equipment | Yes |
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Auto Transfer Molding | Yes |
Auto Packaging Equipment | Yes |
Are you in need of a high-quality and efficient Semiconductor Molding Machine? Look no further than TJIN's Model Number 001. This top-of-the-line product is designed and manufactured in China, adhering to the strict standards of ISO9001 certification.
Our Vertical Injection Molding Machine boasts a clamping force of 1000 KN, making it perfect for molding semiconductors with precision and accuracy. With a capacity of 100 tons, it can handle even the most complex molding projects.
What sets our Semiconductor Molding Machine apart from the rest is its single injection unit, allowing for quick and seamless operation. The maximum mold height of 400 mm gives you the flexibility to create a wide range of semiconductor products.
In this fast-paced world, efficiency is key. That's why our Semiconductor Molding Machine comes equipped with auto packaging equipment. This feature streamlines the packaging process, saving you time and effort. No more manual packaging, no more delays. Our machine does it all for you.
We understand the importance of protecting your investment. That's why our Semiconductor Molding Machine comes with wooden packaging. This ensures that your machine arrives at your doorstep in pristine condition, ready to use.
At TJIN, we believe in meeting the needs of our customers. That's why we have set our minimum order quantity to just 1 unit. Whether you're a small business or a large corporation, we have you covered.
We value your time and understand the urgency of your projects. That's why we guarantee a delivery time of just 40 days. With our efficient manufacturing process and reliable shipping partners, you can trust us to meet your deadlines.
Our payment terms are simple and secure. We accept bank transfers (TT) to ensure a smooth and hassle-free transaction. We also offer flexible payment options for bulk orders.
Don't settle for subpar semiconductor molding machines. Choose TJIN's Semiconductor Molding Machine - Model Number 001 for unparalleled quality, efficiency, and reliability. Place your order now and experience the difference for yourself!
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Heating Power: 12 KW
Cooling System: Water
Model: SM-1000
Clamping Force: 1000 KN
Weight: 5 Tons
At TJIN, we understand the unique needs of the semiconductor industry and are committed to providing the best customized service for our customers. Our Semiconductor Molding Machine, model 001, is designed with the latest technology and high-quality materials to ensure efficient and precise molding of semiconductor products.
Our auto packaging equipment and auto transfer molding capabilities allow for a seamless and efficient production process. With our state-of-the-art equipment and experienced technicians, we guarantee superior quality and consistency in every product.
As a reputable manufacturer in China, we hold an ISO9001 certification, ensuring that our products meet the highest standards of quality and reliability. With a minimum order quantity of 1 and a delivery time of 40 days, we offer flexibility and timely delivery to meet your production needs.
For safe transportation, our products are packaged in sturdy wooden packaging. We also offer various payment terms, including TT, to accommodate our customers' preferences.
With a heating power of 12 KW and a cooling system that uses water, our SM-1000 model is perfect for molding semiconductors. It has a clamping force of 1000 KN and weighs 5 tons, making it a powerful and durable machine.
Choose TJIN for your semiconductor molding needs, and experience exceptional quality, customization, and service. Contact us today for more information or to place an order.
The Semiconductor Molding Machine is carefully packaged to ensure safe delivery to our valued customers. Each machine is first wrapped in protective materials to prevent any damage during transportation.
We use high-quality and durable materials for our packaging, such as sturdy cardboard boxes and foam inserts. This ensures that the machine is well-protected and secure during shipping.
Our shipping process is efficient and timely, with options for both domestic and international delivery. We work with trusted carriers to ensure the fastest and most reliable delivery of our products.
Upon delivery, our customers can expect to receive the machine in excellent condition, ready to be installed and put to use. We also provide detailed instructions and support for installation and operation to ensure a smooth and successful setup.
We take great care in packaging and shipping our Semiconductor Molding Machine, so our customers can have peace of mind knowing their product will arrive safely and ready to use.