Automatic Encapsulation Machine
Product Details:
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● WIN10 + 15 inch touch screen + touch keyboard;
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
Applications:
Semiconductor Molding Machine - TJIN 001
Product Description
The Semiconductor Molding Machine by TJIN is a high-quality and efficient machine designed for use in the production of semiconductors. With a sturdy construction and advanced technology, this machine is perfect for any production facility looking to improve their molding process.
Brand Name
The brand name of this product is TJIN, a trusted and well-known name in the manufacturing industry.
Model Number
The model number of this machine is 001, indicating its advanced and innovative design.
Place of Origin
This product is proudly made in China, known for its high-quality manufacturing and technological advancements.
Certification
This machine has been certified with ISO9001, ensuring its quality and reliability.
Minimum Order Quantity
The minimum order quantity for this product is 1, making it accessible for both small and large scale production facilities.
Packaging Details
The machine is packed in a sturdy wooden packaging, ensuring its safe transport and delivery.
Delivery Time
The average delivery time for this product is 40 days, ensuring a timely and efficient delivery process.
Payment Terms
The payment terms for this product is TT, making it convenient for customers to make payment.
Screw Diameter
The screw diameter of this machine is 35mm, allowing for precise and efficient molding of semiconductors.
Platen Size
The platen size of this machine is 600 x 600mm, providing ample space for large-scale production.
Control System
The control system of this machine is equipped with a PLC, allowing for easy and accurate control of the molding process.
Capacity
With a capacity of 100 tons, this machine can handle high volumes of production without compromising on quality.
Injection Unit
The injection unit of this machine is single, ensuring a streamlined and efficient molding process.
Application
This Semiconductor Molding Machine is suitable for use in various industries such as electronics, automotive, and aerospace. It is especially useful in the production of semiconductors for electronic devices such as smartphones, laptops, and computers.
Scenario
Auto Packaging Equipment, Auto Transfer Molding, and Auto Packaging Equipment are some of the key features of this machine that make it ideal for use in a busy production facility. With its advanced technology and precise control system, this machine can easily integrate into any production line, making the molding process faster and more efficient. The sturdy construction and high-quality components ensure minimal downtime and maximum productivity, making it a valuable asset for any manufacturing company.
Technical Parameters:
| Type | Vertical Injection Molding Machine |
| Control System | PLC |
| Model | SM-1000 |
| Cooling System | Water |
| Weight | 5 Tons |
| Clamping Force | 1000KN |
| Capacity | 100 Tons |
| Screw Diameter | 35 Mm |
| Max. Mold Height | 400Mm |
| Injection Pressure | 200 Mpa |
| Auto Transfer Molding | Yes |
| Auto Packaging Equipment | Yes |
