Chip Molding Equipment
Features:
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
| Type | Vertical Injection Molding Machine |
| Control System | PLC |
| Model | SM-1000 |
| Cooling System | Water |
| Weight | 5 Tons |
| Clamping Force | 1000 KN |
| Capacity | 100 Tons |
| Screw Diameter | 35 Mm |
| Max. Mold Height | 400 Mm |
| Injection Pressure | 200 MPa |
| Auto Transfer Molding | Yes |
| Auto Packaging Equipment | Yes |
The Semiconductor Molding Machine by TJIN is a high-quality and efficient machine designed for use in the production of semiconductors. With a sturdy construction and advanced technology, this machine is perfect for any production facility looking to improve their molding process.
The brand name of this product is TJIN, a trusted and well-known name in the manufacturing industry.
The model number of this machine is 001, indicating its advanced and innovative design.
This product is proudly made in China, known for its high-quality manufacturing and technological advancements.
This machine has been certified with ISO9001, ensuring its quality and reliability.
The minimum order quantity for this product is 1, making it accessible for both small and large scale production facilities.
The machine is packed in a sturdy wooden packaging, ensuring its safe transport and delivery.
The average delivery time for this product is 40 days, ensuring a timely and efficient delivery process.
The payment terms for this product is TT, making it convenient for customers to make payment.
The screw diameter of this machine is 35mm, allowing for precise and efficient molding of semiconductors.
The platen size of this machine is 600 x 600mm, providing ample space for large-scale production.
The control system of this machine is equipped with a PLC, allowing for easy and accurate control of the molding process.
With a capacity of 100 tons, this machine can handle high volumes of production without compromising on quality.
The injection unit of this machine is single, ensuring a streamlined and efficient molding process.
This Semiconductor Molding Machine is suitable for use in various industries such as electronics, automotive, and aerospace. It is especially useful in the production of semiconductors for electronic devices such as smartphones, laptops, and computers.
Auto Packaging Equipment, Auto Transfer Molding, and Auto Packaging Equipment are some of the key features of this machine that make it ideal for use in a busy production facility. With its advanced technology and precise control system, this machine can easily integrate into any production line, making the molding process faster and more efficient. The sturdy construction and high-quality components ensure minimal downtime and maximum productivity, making it a valuable asset for any manufacturing company.
This Semiconductor Molding Machine, model number 001, is designed and manufactured by TJIN in China. It is certified with ISO9001 and has a minimum order quantity of 1 unit. The packaging details include wooden packaging for safe delivery. The delivery time for this machine is 40 days and the payment terms are TT.
The platen size of this machine is 600 X 600 mm, with a heating power of 12 KW and a screw diameter of 35 mm. It has a capacity of 100 tons and is equipped with a PLC control system for efficient operation.
At TJIN, we understand the importance of customization for our customers. That's why we offer a customization service for our Semiconductor Molding Machine. Our expert team will work with you to tailor the machine to fit your specific needs and requirements. With our customization service, you can ensure that the machine meets all your production needs and delivers the best results.
Invest in our Semiconductor Molding Machine with our customization service and experience the benefits of efficient and effective auto packaging equipment for your business.
The Semiconductor Molding Machine will be carefully packaged and shipped to ensure its safe arrival at your designated location. Our packaging process follows industry standards and is designed to protect the machine from any potential damage during transit.
The machine will be first wrapped in a layer of protective material, such as bubble wrap or foam, to prevent any scratches or dents. It will then be placed in a sturdy cardboard box with additional padding for added protection.
In addition, any delicate parts or components will be individually wrapped and secured to prevent any potential damage during transportation.
We offer both domestic and international shipping options for our customers. All shipments will be made through reputable carriers, such as FedEx or DHL, to ensure timely and reliable delivery.
For international shipments, we will handle all necessary customs and documentation to ensure a smooth delivery process. However, please note that any additional customs fees or taxes imposed by the destination country will be the responsibility of the customer.
Once your order has been shipped, you will receive a tracking number to monitor the progress of your delivery. Our team will also stay in touch to provide any updates or address any concerns that may arise during the shipping process.
Upon arrival, please carefully inspect the package for any signs of damage. If there are any issues, please contact us immediately so we can assist in resolving the issue.
Thank you for choosing our Semiconductor Molding Machine. We are committed to providing the best packaging and shipping services to ensure your satisfaction with our product. If you have any further questions or concerns, please do not hesitate to contact us.
