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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine
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Features
Specifications
Control System: PLC
Cooling System: Water Cooling
Dimensions: 2000x1500x2500 Mm
Heating Power: 10 KW
Injection Pressure: 200 MPa
Injection Rate: 1000 Cm3/s
Machine Weight: 5 Tons
Max. Clamping Force: 1000 KN
Mold Height: 200-500 Mm
Operation Mode: Automatic
Platen Size: 600x600 Mm
Power Supply: AC 220V/380V
Screw Diameter: 40 Mm
High Light:

ISO9001 Semiconductor Molding Machine

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Chip Injection Transfer Moulding Machine

,

Semiconductor Transfer Moulding Machine

Basic Infomation
Place of Origin: China
Brand Name: TJIN
Certification: ISO9001
Payment & Shipping Terms
Packaging Details: Wooden Packing
Delivery Time: 40 days
Product Description

Auto Chip Transfer Molding

 

Performance Parameters:

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● Standardized mold structure, easy to change;

● High efficiency cake loading component, aluminum box loading;

 

 

Customization:

TJIN Semiconductor Molding Machine - Customized Service

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Product Attributes:
  • Auto Transfer Molding
  • Auto Packaging Equipment
  • Auto Packaging Equipment
  • Injection Unit: Single
  • Max. Mold Height: 400 Mm
  • Screw Diameter: 35 Mm
  • Cooling System: Water
  • Control System: PLC

Packing and Shipping:

Product Name: Semiconductor Molding Machine
Packaging and Shipping:
  • Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
  • The packaging also includes foam inserts to protect the delicate components of the machine.
  • For international shipping, the machine will be packed in a wooden crate for extra protection.
  • The package will be labeled with the product name, model number, and any necessary handling instructions.
  • For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
  • International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.

 

Technical Parameters:

Technical Parameters Value
Screw Diameter 35 mm
Model SM-1000
Clamping Force 1000 KN
Platen Size 600 x 600 mm
Cooling System Water
Max. Mold Height 400 mm
Capacity 100 tons
Type Vertical Injection Molding Machine
Injection Pressure 200 MPa
Heating Power 12 KW
Product Features Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging

 

 

Applications:

Semiconductor Molding Machine - TJIN 001

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Heating Power: 12 KW

Control System: PLC

Clamping Force: 1000 KN

Max. Mold Height: 400 Mm

Type: Vertical Injection Molding Machine

Product Description

The Semiconductor Molding Machine from TJIN is a highly efficient and advanced machine designed specifically for the molding of semiconductor materials. It is suitable for use in various industries such as electronics, automotive, and medical.

Features and Benefits
  • Auto Packaging Equipment: The machine comes equipped with auto packaging equipment, making the packaging process quick and efficient.
  • High Precision Molding: With a control system that utilizes PLC technology, the machine ensures high precision molding of semiconductor materials, resulting in high-quality products.
  • Fast Delivery Time: With a delivery time of only 40 days, customers can receive their orders in a timely manner, reducing downtime and increasing productivity.
  • Easy to Use: The machine is designed to be user-friendly, with a simple interface and easy-to-follow instructions, making it easy for operators to use.
  • Durable and Reliable: Made with high-quality materials and advanced technology, the machine is built to last and can withstand heavy usage, ensuring long-term reliability.
  • Vertical Design: The vertical design of the machine allows for a smaller footprint, making it suitable for use in smaller spaces.
  • ISO9001 Certified: The machine is certified by ISO9001, ensuring that it meets international standards of quality and safety.
Applications
  • Electronics Industry - The Semiconductor Molding Machine is ideal for molding semiconductor materials used in electronic devices such as computers, smartphones, and other gadgets.
  • Automotive Industry - The machine can also be used for molding semiconductor components used in cars and other vehicles, ensuring high-quality and precise production.
  • Medical Industry - With its high precision molding capabilities, the machine is suitable for molding semiconductor materials used in medical devices such as pacemakers and insulin pumps.
Packaging and Delivery

The machine is carefully packaged in wooden packaging to ensure safe transportation. It can be delivered within 40 days after placing the order, making it an ideal choice for customers with urgent production needs.

Ordering Information

To place an order for the Semiconductor Molding Machine from TJIN, please contact us with your specific requirements and we will provide you with a competitive quote. The minimum order quantity is 1 machine, and payment can be made via TT.

Experience the precision and efficiency of the TJIN Semiconductor Molding Machine and take your production to the next level. Contact us today!

Customization:

TJIN Semiconductor Molding Machine - Customized Service

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Product Attributes:
  • Auto Transfer Molding
  • Auto Packaging Equipment
  • Auto Packaging Equipment
  • Injection Unit: Single
  • Max. Mold Height: 400 Mm
  • Screw Diameter: 35 Mm
  • Cooling System: Water
  • Control System: PLC

Packing and Shipping:

Product Name: Semiconductor Molding Machine
Packaging and Shipping:
  • Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
  • The packaging also includes foam inserts to protect the delicate components of the machine.
  • For international shipping, the machine will be packed in a wooden crate for extra protection.
  • The package will be labeled with the product name, model number, and any necessary handling instructions.
  • For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
  • International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.

FAQ:

  • Q: What is the brand name of this product?
  • A: The brand name is TJIN.
  • Q: What is the model number of this product?
  • A: The model number is 001.
  • Q: Where is this product manufactured?
  • A: This product is manufactured in China.
  • Q: Does this product have any certifications?
  • A: Yes, it is certified with ISO9001.
  • Q: What is the minimum order quantity for this product?
  • A: The minimum order quantity is 1.
  • Q: How is this product packaged?
  • A: It is packaged in wooden packaging.
  • Q: What is the estimated delivery time for this product?
  • A: The estimated delivery time is 40 days.
  • Q: What are the accepted payment terms for this product?
  • A: The accepted payment terms are TT (telegraphic transfer).
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