Auto Semiconductor Transfer Molding
Taijin Semiconductor specializes in the research, development and production of semiconductor packaging equipment and chip packaging equipment: including automatic plastic sealing system, intelligent automatic rib cutting and molding separation system, rib cutting and molding equipment, automatic plastic sealing press, automatic chip arranging machine, flushing runner residual adhesive machine, etc., not only to customize a single piece of equipment, but also committed to solving the semiconductor packaging of the whole set of system solutions, according to the needs of the customized, high-precision, stable performance, quality assurance, and permanently provide high-quality service.
The Semiconductor Molding Machine is a state-of-the-art product designed for the semiconductor industry. This advanced machine is capable of providing high precision molding and has a clamping force of 1000 KN, making it suitable for a wide range of applications. With its advanced technology and efficient design, it is the perfect solution for all your molding needs.
The clamping force of 1000 KN makes this machine capable of handling even the most complex and intricate molding tasks with ease. This feature ensures that the final product is of the highest quality and meets all the required specifications. The high clamping force also allows for a larger range of mold sizes to be used, making it a versatile option for various molding needs.
The cooling system of the Semiconductor Molding Machine is designed to use water, which is a highly efficient and cost-effective method of cooling. This ensures that the machine runs at optimal temperatures, resulting in a higher production rate and reduced downtime. The use of water also makes it an environmentally friendly option, making it the ideal choice for any modern production facility.
The screw diameter of 35 mm is carefully selected to provide the perfect balance of precision and efficiency. This allows for precise control over the molding process, resulting in products with high accuracy and consistency. The size is also ideal for various molding materials, making it a versatile option for different production needs.
The maximum mold height of 400 mm provides ample room for a variety of molding tasks. This feature is especially useful for complex and intricate molds that require more space. With the Semiconductor Molding Machine, you can be assured that your products will be molded with utmost precision, regardless of the mold size or complexity.
The capacity of 100 tons is a testament to the efficiency and robustness of this machine. With its ability to handle large volumes of material, it is the perfect choice for high-volume production facilities. The high capacity also ensures that the machine can withstand heavy loads and operate smoothly, resulting in a longer lifespan and reduced maintenance costs.
The Semiconductor Molding Machine is equipped with auto packaging equipment, which makes the final step of the production process quick and effortless. This feature eliminates the need for manual packaging, saving time and labor costs. With the auto packaging equipment, you can be confident that your products will be packaged with precision and care.
The auto transfer molding feature of this machine allows for efficient and seamless transfer of material from the injection unit to the mold. This results in a faster production process and ensures that the final products are free from defects. With the auto transfer molding feature, you can achieve a higher level of precision and efficiency in your production process.
The Semiconductor Molding Machine is equipped with advanced auto transfer molding equipment, which is designed to handle a wide range of materials and molds. This feature ensures that the machine can adapt to various production needs and produce high-quality products consistently. With the auto transfer molding equipment, you can streamline your production process and achieve maximum efficiency.
The Semiconductor Molding Machine is specifically designed for the semiconductor industry, making it the perfect solution for all your semiconductor packaging needs. With its advanced technology and precise molding capabilities, it can produce high-quality packaging for various semiconductor products. The Semiconductor Molding Machine is the ultimate solution for all your semiconductor packaging needs.
The Semiconductor Molding Machine is known for its high precision molding capabilities. With its advanced technology and precise control over the molding process, it can produce products with unparalleled accuracy and consistency. This feature makes it the preferred choice for industries that require precision and quality in their products.
The Semiconductor Molding Machine is designed to operate with maximum efficiency, resulting in higher production rates and reduced downtime. With its advanced technology and efficient design, it can handle large volumes of material without compromising on the quality of the final product. This makes it the perfect choice for industries that require high efficiency and productivity.
The Semiconductor Molding Machine is equipped with advanced technology that sets it apart from other molding machines in the market. With its state-of-the-art features and precision molding capabilities, it is the perfect solution for industries that require high-quality and efficient production. The advanced technology of this machine ensures that it can meet all your molding needs and exceed your expectations.
| Technical Parameters | Value |
|---|---|
| Screw Diameter | 35 mm |
| Model | SM-1000 |
| Clamping Force | 1000 KN |
| Platen Size | 600 x 600 mm |
| Cooling System | Water |
| Max. Mold Height | 400 mm |
| Capacity | 100 tons |
| Type | Vertical Injection Molding Machine |
| Injection Pressure | 200 MPa |
| Heating Power | 12 KW |
| Product Features | Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Heating Power: 12 KW
Control System: PLC
Clamping Force: 1000 KN
Max. Mold Height: 400 Mm
Type: Vertical Injection Molding Machine
The Semiconductor Molding Machine from TJIN is a highly efficient and advanced machine designed specifically for the molding of semiconductor materials. It is suitable for use in various industries such as electronics, automotive, and medical.
The machine is carefully packaged in wooden packaging to ensure safe transportation. It can be delivered within 40 days after placing the order, making it an ideal choice for customers with urgent production needs.
To place an order for the Semiconductor Molding Machine from TJIN, please contact us with your specific requirements and we will provide you with a competitive quote. The minimum order quantity is 1 machine, and payment can be made via TT.
Experience the precision and efficiency of the TJIN Semiconductor Molding Machine and take your production to the next level. Contact us today!
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
