Semicon IC Lead Frame Mold
Scope of application: integrated circuit, separator body leading framework
Processing method: ultra -precision processing
Product size: Customized size according to customer
Processing accuracy: 0.001mm
Production cycle: 12-15 days
FAQ:
| Product Name | IC Lead Frame Stamping Mold |
|---|---|
| Material | Steel |
| Hardness | HRC 50-60 |
| Mold Size | Customized |
| Runner System | Hot Runner/Cold Runner |
| Surface Treatment | Nickel Plating |
| Mold Type | Stamping Mold |
| Application | IC Lead Frame Stamping |
| Mold Design | 3D/2D |
| Lead Time | 4-6 Weeks |
| Mold Base | LKM, DME, HASCO, Etc. |
Are you looking for a reliable and high-quality mold for your IC lead frame production? Look no further! TJIN's IC Lead Frame Stamping Mold is here to meet all your needs. With our advanced technology and expertise, we provide customized solutions for all your semiconductor IC lead frame molding requirements.
TJIN is a renowned brand in the field of mold manufacturing, known for its high-quality and precision products. Our IC Lead Frame Stamping Mold is a testament to our commitment to excellence and customer satisfaction.
Our IC Lead Frame Stamping Mold comes with model number 006, indicating its advanced and upgraded version, incorporating the latest technology and features for improved performance and efficiency.
Our IC Lead Frame Stamping Mold is proudly made in China, a country known for its advanced technology and expertise in the field of mold manufacturing. We ensure that our products meet the highest standards of quality and precision, making us a preferred choice for customers worldwide.
Our IC Lead Frame Stamping Mold is ISO9001 certified, indicating our commitment to quality management and continuous improvement. This certification ensures that our products meet the highest standards of quality and are in compliance with international standards.
We understand that every customer's need is unique, and we are committed to providing customized solutions for each requirement. Therefore, we have set the minimum order quantity for our IC Lead Frame Stamping Mold at 1, allowing our customers to order as per their specific needs.
To ensure the safe delivery of our products, we use high-quality wooden packaging for our IC Lead Frame Stamping Mold. This packaging provides protection against any damage during transportation, ensuring that the product reaches our customers in perfect condition.
At TJIN, we understand the importance of timely delivery. Therefore, we ensure that our IC Lead Frame Stamping Mold is delivered to our customers within 40 days, providing them with a quick and efficient solution for their semiconductor IC lead frame production.
We offer flexible payment terms for our customers, and our preferred mode of payment is TT (telegraphic transfer). However, we also accept other modes of payment as per our customer's convenience.
Our IC Lead Frame Stamping Mold has a hardness of HRC 50-60, ensuring its durability and long-lasting performance. This hardness level is ideal for semiconductor manufacturing, providing precision and accuracy in the production process.
Our IC Lead Frame Stamping Mold comes with a 3D/2D mold design, providing our customers with a comprehensive view of the product before its production. This design helps in identifying any potential issues and ensures a flawless and efficient production process.
We understand that every customer's requirements are unique, and we provide customized solutions to meet their specific needs. Therefore, our IC Lead Frame Stamping Mold comes in a customized size, as per our customer's specifications and requirements.
Our IC Lead Frame Stamping Mold comes with a hot runner/cold runner system, providing our customers with the flexibility to choose the most suitable option for their production process. This system ensures efficient and precise molding of the lead frames.
Our IC Lead Frame Stamping Mold comes with a mold base from renowned brands like LKM, DME, HASCO, and others. This ensures the quality and durability of our product, making it a preferred choice for our customers.
With TJIN's IC Lead Frame Stamping Mold, you can be assured of a high-quality and efficient solution for all your semiconductor IC lead frame production needs. Contact us now to get a quote and experience our exceptional products and services.
Brand Name: TJIN
Model Number: 006
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Mold Life: 100,000 Shots
Mold Type: Stamping Mold
Runner System: Hot Runner/Cold Runner
Mold Base: LKM, DME, HASCO, Etc.
Hardness: HRC 50-60
At TJIN, we specialize in providing high-quality lead frame stamping molds for our customers. Our IC Lead Frame Stamping Mold (Model Number: 006) is designed and manufactured in China, and certified with ISO9001 for its quality and reliability.
Our professional team of experts will work closely with you to customize the mold according to your specific requirements. We have a minimum order quantity of 1, and our packaging is done in wooden crates to ensure safe delivery.
With a mold life of 100,000 shots and a hardness of HRC 50-60, our stamping mold is built to last and withstand high production volumes. You can choose between a hot runner or cold runner system, and the mold base options include LKM, DME, HASCO, and more.
Trust TJIN for all your IC lead frame stamping mold needs. Contact us today for more information and to place your order.
