| Tolerance | ±0.01mm |
|---|---|
| Mold Base | LKM, DME, HASCO, Etc. |
| Mold Life | 100,000 Shots |
| Mold Type | Stamping Mold |
| Lead Time | 4-6 Weeks |
| Application | Semiconductor Manufacturing |
|---|---|
| Capacity | 1000 Tons |
| Control System | PLC |
| Frequency | 50Hz |
| Injection Pressure | 200 MPa |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 Tons |
| Control System | PLC Control |
| Injection Speed | 1000 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Heating Zones | 4 |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Cooling System | Water Cooling |
| Heating Power | 10 KW |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Cooling System | Water Cooling |
| Capacity | 2000 Tons |
|---|---|
| Clamping Force | 2000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Injection Speed | 300 Mm/s |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | High |
| Control System | PLC |
| Cooling System | Water Cooling |
| Accuracy | High |
|---|---|
| Application | Semiconductor Manufacturing |
| Automation Level | Fully Automated |
| Capacity | High |
| Clamping Force | High |