| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | Depends On Model |
| Clamping Force | Depends On Model |
| Control System | PLC |
| Platen Size | 600 X 600 Mm |
|---|---|
| Clamping Force | 1000 KN |
| Max. Mold Height | 400 Mm |
| Cooling System | Water |
| Model | SM-1000 |
| Packaging Details | Wooden Packing |
|---|---|
| Delivery Time | 40 days |
| Place of Origin | China |
| Brand Name | TJIN |
| Certification | ISO9001 |
| Application | Semiconductor Industry |
|---|---|
| Automation Grade | Automatic |
| Capacity | Depends On The Model |
| Clamping Force | Depends On The Model |
| Control System | PLC |
| Accuracy | High |
|---|---|
| Application | Semiconductor Manufacturing |
| Automation Level | Fully Automated |
| Capacity | High |
| Clamping Force | High |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 10000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 5000 KN |
| Control System | PLC |
| Cooling Zones | 4 |
| Capacity | 100 Tons |
|---|---|
| Clamping Force | 1000 KN |
| Control System | PLC |
| Frequency | 50/60Hz |
| Injection Speed | 200 Mm/s |
| Control System | PLC |
|---|---|
| Temperature Control | Precision Temperature Control |
| Product Type | Molding Equipment |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Application | Semiconductor Manufacturing |
|---|---|
| Capacity | 1000 Tons |
| Control System | PLC |
| Frequency | 50Hz |
| Injection Pressure | 200 MPa |