Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | Depends On Model |
Clamping Force | Depends On Model |
Control System | PLC |
Packaging Details | Wooden Packing |
---|---|
Delivery Time | 40 days |
Place of Origin | China |
Brand Name | TJIN |
Certification | ISO9001 |
Platen Size | 600 X 600 Mm |
---|---|
Clamping Force | 1000 KN |
Max. Mold Height | 400 Mm |
Cooling System | Water |
Model | SM-1000 |
Application | Semiconductor Industry |
---|---|
Automation Grade | Automatic |
Capacity | Depends On The Model |
Clamping Force | Depends On The Model |
Control System | PLC |
Capacity | 100 Tons |
---|---|
Clamping Force | 1000 KN |
Control System | PLC |
Frequency | 50/60Hz |
Injection Speed | 200 Mm/s |
Accuracy | High |
---|---|
Application | Semiconductor Manufacturing |
Automation Level | Fully Automated |
Capacity | High |
Clamping Force | High |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 10000 KN |
Control System | PLC |
Injection Pressure | 200 MPa |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 5000 KN |
Control System | PLC |
Cooling Zones | 4 |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | 1000 Tons |
Control System | PLC |
Cooling System | Water Cooling |
Control System | PLC |
---|---|
Temperature Control | Precision Temperature Control |
Product Type | Molding Equipment |
Automation | Fully Automated |
Molding Method | Injection Molding |