Application | Semiconductor Industry |
---|---|
Capacity | 100 Tons |
Clamping Force | 1000 KN |
Control System | PLC |
Cooling System | Water Cooling |
Application | Semiconductor Manufacturing |
---|---|
Capacity | 1000 Tons |
Control System | PLC |
Frequency | 50Hz |
Injection Pressure | 200 MPa |
Capacity | 1000 Tons |
---|---|
Clamping Force | 1000 Tons |
Ejector Force | 200 Tons |
Injection Pressure | 2000 Bar |
Injection Unit | Single |
Cycle Time | Short |
---|---|
Safety Features | Advanced |
Material | Plastic |
Automation | Fully Automated |
Molding Method | Injection Molding |
Control System | PLC |
---|---|
Energy Consumption | Low |
Maintenance | Easy |
Molding Method | Injection Molding |
Precision | High |