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Phone Number :	+86 13450030904
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Keywords [ semiconductor processing equipment ] match 140 Products.

Steel Nitriding Trimming Forming Dies Semiconductor Molding Molds

MOQ: 1 set

Features	High Precision, Durable, Customizable
Application	Metal Trimming And Forming
Compatibility	Compatible With Various Metal Materials
Durability	Long-lasting
Function	Trimming And Forming

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

MOQ: 1

Mold Cooling System	Water Cooling
Tolerance	±0.01mm
Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

MOQ: 1 set

Capacity	1000 Tons
Clamping Force	1000 KN
Control System	PLC Control
Ejector Force	50 KN
Ejector Stroke	300 Mm

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

MOQ: 1 set

Control System	PLC
Cooling System	Water Cooling
Dimensions	2000x1500x2500 Mm
Heating Power	10 KW
Injection Pressure	200 MPa

Polished Trim And Form Dies Semiconductor Package Dies Customizable

MOQ: 1 set

Application	Metal Forming
Compatibility	Compatible With Various Machines
Cost	Affordable
Customization	Available
Durability	High

Customization Trim And Forming Mold For Semicon Processing High Durability

MOQ: 1 set

Application	Automotive Industry
Compatibility	Suitable For Various Types Of Metal Sheets
Cost	Affordable
Customization	Available
Durability	High

500mm Dimensions Trim And Form Machine Used In Semiconductor Industry

Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm
Power Consumption	Approx. 1.5kW
Weight	Approx. 500kg
Safety Features	Emergency Stop Button, Safety Light Curtain
Control System	PLC Control System

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

MOQ: 1

Compatibility	Suitable For Various Machines
Resistance	Corrosion And Wear
Shape	Round
Usage	Industrial
Size	Customized

Antirust Long Life Semiconductor Mold Cutting And Forming Dies High Accuracy

MOQ: 1 set

Accuracy	Accurate
Application	Metal Sheet Trimming And Forming
Compatibility	Versatile
Cost-Effectiveness	Cost-efficient
Customization	Available

Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing

MOQ: 1 set

Application	Manufacturing
Cavity	Single Or Multiple
Compatibility	Wide Range Of Materials
Cost	Competitive
Cycle Time	Short

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No. 3 Xialian Road, Chang'an Town, Dongguan City, Guangdong Province, China

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+86 13450030904

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor processing equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Steel Nitriding Trimming Forming Dies Semiconductor Molding Molds

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

High Capacity 100 Tons Semiconductor Molding Machine Automatic Molding Press

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

Polished Trim And Form Dies Semiconductor Package Dies Customizable

Customization Trim And Forming Mold For Semicon Processing High Durability

500mm Dimensions Trim And Form Machine Used In Semiconductor Industry

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

Antirust Long Life Semiconductor Mold Cutting And Forming Dies High Accuracy

Wear Resistant T0263/247/Plastic Seal MGP Mold For Semiconductor Manufacturing