| Capacity | 100 Tons |
|---|---|
| Platen Size | 600 X 600 Mm |
| Type | Vertical Injection Molding Machine |
| Injection Unit | Single |
| Heating Power | 12 KW |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 5000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 100 Tons |
| Clamping Force | 1000 KN |
| Cooling System | Water Cooling |
| Heating Power | 10 KW |
| Screw Diameter | 35 Mm |
|---|---|
| Type | Vertical Injection Molding Machine |
| Injection Unit | Single |
| Capacity | 100 Tons |
| Cooling System | Water |
| Max. Mold Height | 400 Mm |
|---|---|
| Cooling System | Water |
| Injecti On Unit | Single |
| Weight | 5 Tons |
| Heating Power | 12 KW |
| Capacity | 1000 Tons |
|---|---|
| Clamping Force | 1000 KN |
| Control System | PLC Control |
| Ejector Force | 50 KN |
| Ejector Stroke | 300 Mm |
| Application | Semiconductor Industry |
|---|---|
| Automation Grade | Automatic |
| Capacity | Depends On Model |
| Clamping Force | Depends On Model |
| Control System | PLC |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 1000 KN |
| Control System | PLC |
| Injection Speed | 200 Mm/s |
| Application | Semiconductor Manufacturing |
|---|---|
| Capacity | 500-1000 Tons |
| Clamping Force | Hydraulic |
| Control System | PLC |
| Cooling System | Water/Oil |
| Control System | PLC |
|---|---|
| Cooling System | Water |
| Frequency | 50Hz |
| Heating Zones | 6 |
| Injection Pressure | 200 MPa |
