| Control System | PLC |
|---|---|
| Cooling System | Water Cooling |
| Dimensions | 2000x1500x2500 Mm |
| Heating Power | 10 KW |
| Injection Pressure | 200 MPa |
| Capacity | 1000 Units/hour |
|---|---|
| Clamping Force | 200 Tons |
| Control System | PLC |
| Cooling System | Water |
| Injection Pressure | 100 MPa |
| Application | Semiconductor Manufacturing |
|---|---|
| Capacity | 1000 Tons |
| Control System | PLC |
| Frequency | 50Hz |
| Injection Pressure | 200 MPa |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automated |
| Capacity | High |
| Control System | PLC |
| Frequency | 50Hz/60Hz |
| Capacity | 2000 Tons |
|---|---|
| Clamping Force | 2000 KN |
| Control System | PLC |
| Injection Pressure | 200 MPa |
| Injection Speed | 300 Mm/s |
| Capacity | 1000 Tons |
|---|---|
| Clamping Force | 1000 Tons |
| Ejector Force | 200 Tons |
| Injection Pressure | 2000 Bar |
| Injection Unit | Single |
| Application | Semiconductor Industry |
|---|---|
| Capacity | 1000 Tons |
| Clamping Force | 5000 KN |
| Control System | PLC |
| Cooling Zones | 4 |
| Application | Semiconductor Industry |
|---|---|
| Automation | Fully Automatic |
| Capacity | 1000 Tons |
| Control System | PLC |
| Cooling System | Water Cooling |
| Control System | PLC |
|---|---|
| Temperature Control | Precision Temperature Control |
| Product Type | Molding Equipment |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Control System | PLC |
|---|---|
| Energy Consumption | Low |
| Maintenance | Easy |
| Molding Method | Injection Molding |
| Precision | High |