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Phone Number :	+86 13450030904
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Keywords [ semiconductor packaging equipment ] match 148 Products.

MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

MOQ: 1 set

Application	Mold Making
Coating	Available
Color	Silver
Durability	High
Heat Treatment	Available

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

MOQ: 1 set

Application	Industrial
Color	Silver
Compatibility	Fits Most Casting Machines
Durability	High
Material	Aluminum

High Precision Trimming Forming Dies With ISO9001 Certification

MOQ: 1 set

Application	Metalworking
Compatibility	Versatile
Design	Customizable
Durability	Long-lasting
Function	Precision Trimming And Forming

Customization Trim And Forming Mold For Semicon Processing High Durability

MOQ: 1 set

Application	Automotive Industry
Compatibility	Suitable For Various Types Of Metal Sheets
Cost	Affordable
Customization	Available
Durability	High

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface
Application	Metal Trimming And Forming
Compatibility	Fits With Various Machines
Durability	Long-lasting
Hardness	HRC 58-62

Tendon Trim And Form Machine

MOQ: 1 set

Control System	PLC
Dimensions	1200mm X 800mm X 1500mm
Forming Method	Pneumatic Press
Forming Pressure	0.5 - 0.7MPa
Maximum Processing Size	200mm X 200mm

High Performance Auto Layup Chip Sorter Machine Customized On Demand

Capacity	1000 Chips Per Minute
Control System	PLC
Dimensions	1200mm X 800mm X 1000mm
Material	Stainless Steel
Operating Interface	Touch Screen

Adjustable Speed Wafer Sorters Auto Array Machine Stable Performance

MOQ: 1 set

Dimensions	1500mm X 800mm X 1200mm
Input Voltage	220V/50Hz
Power Consumption	Less Than 1kW
Product Capacity	Up To 1000 Chips Per Minute
Product Function	Sorts Chips By Size, Shape, And Color

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PLC Control Automatic Trim And Form Machine After Plasticizing

MOQ: 1 set

Control System	PLC
Dimensions	1200mm X 800mm X 1500mm
Frequency	50Hz
Material	Stainless Steel
Max Working Speed	1000pcs/h

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use

MOQ: 1 set

Features	Sharp Cutting Edge, Smooth Surface, Easy To Use
Advantages	Efficient, Cost-effective, Time-saving
Application	Metal Trimming And Forming
Compatibility	Compatible With Various Press Machines
Customization	Available

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+86 13450030904

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Semiconductor Molding Machine Trim And Form Machine IC Lead Frame Stamping Mold All Categories

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semiconductor packaging equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

MBF / TSSOP Series Of Plastic Seal MGP Mold High Durability LKM Standard

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

High Precision Trimming Forming Dies With ISO9001 Certification

Customization Trim And Forming Mold For Semicon Processing High Durability

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

Tendon Trim And Form Machine

High Performance Auto Layup Chip Sorter Machine Customized On Demand

Adjustable Speed Wafer Sorters Auto Array Machine Stable Performance

PLC Control Automatic Trim And Form Machine After Plasticizing

Semicon Processing Trim Form Mold Corrosion Proof Easy To Use