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Keywords [ semiconductor processing equipment ] match 140 products.

Intelligent Auto Trim And Form Machine For Semiconductor Industry

500mm Dimensions Trim And Form Machine Used In Semiconductor Industry

Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm
Power Consumption	Approx. 1.5kW
Weight	Approx. 500kg
Safety Features	Emergency Stop Button, Safety Light Curtain
Control System	PLC Control System

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

MOQ: 1 set

Application	Industrial
Color	Silver
Compatibility	Fits Most Casting Machines
Durability	High
Material	Aluminum

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

MOQ: 1

Compatibility	Suitable For Various Machines
Resistance	Corrosion And Wear
Shape	Round
Usage	Industrial
Size	Customized

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

Polished Trim And Form Dies Semiconductor Package Dies Customizable

Customization Trim And Forming Mold For Semicon Processing High Durability

Antirust Long Life Semiconductor Mold Cutting And Forming Dies High Accuracy

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

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semiconductor processing equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Intelligent Auto Trim And Form Machine For Semiconductor Industry

500mm Dimensions Trim And Form Machine Used In Semiconductor Industry

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine

Polished Trim And Form Dies Semiconductor Package Dies Customizable

Customization Trim And Forming Mold For Semicon Processing High Durability

Antirust Long Life Semiconductor Mold Cutting And Forming Dies High Accuracy

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing