Fully Automatic Transfer Molding'
Features
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
| Parameter | Value |
|---|---|
| Maintenance | Easy |
| Control System | PLC |
| Application | Semiconductor Industry |
| Capacity | High |
| Cycle Time | Short |
| Safety Features | Advanced |
| Molding Method | Injection Molding |
| Precision | High |
| Energy Consumption | Low |
| Pressure Control | Precision Pressure Control |
| Product Name | Semiconductor Molding Equipment |
|---|---|
| Automatic Features | Fully Automatic Molding System, Fully Automatic Molding System, Automatic Molding Machine |
| Maintenance | Easy |
| Control System | PLC |
| Application | Semiconductor Industry |
| Capacity | High |
| Cycle Time | Short |
| Safety Features | Advanced |
| Molding Method | Injection Molding |
| Precision | High |
| Energy Consumption | Low |
| Pressure Control | Precision Pressure Control |
TJIN Semiconductor Molding Equipment is a cutting-edge product designed and manufactured in China by TJIN. It is a fully automatic molding system that uses advanced PLC control system to ensure high precision, high efficiency, and safe operation.
Our product is specifically designed for the semiconductor industry, where precision and efficiency are crucial. It is a state-of-the-art molding equipment that can be used in various applications, including semiconductor packaging, LED packaging, and electronic component manufacturing.
The molding equipment is made of high-quality plastic material, ensuring durability and longevity. This makes it suitable for long-term use in demanding semiconductor manufacturing environments.
With its fully automatic molding system, the TJIN Molding Equipment has a high production capacity, making it ideal for large-scale production in the semiconductor industry. It can produce a high volume of high-quality products in a short period, increasing efficiency and reducing production time.
Our molding equipment is widely used in semiconductor packaging, where it can produce high-precision and high-quality semiconductor packages. The intelligent control system ensures stability and flexibility, making it suitable for various semiconductor packaging designs.
In the LED industry, our molding equipment plays a crucial role in producing LED packages with high precision and efficiency. With its fully automatic molding system, it can handle different types and sizes of LED packages, meeting the diverse needs of the LED industry.
Our product is also ideal for electronic component manufacturing, where it can produce high-quality plastic components with precise dimensions. The safe operation and advanced safety features ensure the protection of both the equipment and the operators.
The TJIN Molding Equipment is a fully automatic system, eliminating the need for manual labor and reducing the possibility of human errors. This increases efficiency and ensures consistent and high-quality production.
The automatic molding press allows for efficient and precise molding of plastic materials. It operates at high speeds, reducing production time and increasing output.
With its advanced PLC control system and high-quality material, the TJIN Molding Equipment can achieve high precision in the molding process. This ensures the production of accurate and consistent products.
The intelligent control system and fully automatic operation make our molding equipment highly efficient. It can produce a high volume of products in a short period, reducing production time and costs.
The intelligent control system allows for easy operation and monitoring of the molding process. It also has the capability to store and analyze production data, providing valuable insights for process improvement.
The TJIN Molding Equipment is designed to be stable and flexible, making it suitable for various molding requirements and designs. It can handle different types of plastic materials and produce a wide range of products.
Our product is made of high-quality plastic material, ensuring its durability and longevity. It can withstand the demands of the semiconductor industry and operate efficiently for a long period.
The TJIN Molding Equipment is equipped with advanced safety features to ensure safe operation. It is designed to protect both the equipment and the operators, providing a safe working environment.
Brand Name: TJIN
Model Number: 002
Place of Origin: China
Control System: PLC (Programmable Logic Controller)
Precision: High
Cycle Time: Short
Material: Plastic
Temperature Control: Precision Temperature Control
Key Features:
Our Semiconductor Molding Equipment is carefully packaged to ensure safe delivery to our customers. Each unit is packed in a sturdy wooden crate with foam padding to protect against any damage during transportation.
For international shipping, the equipment is securely strapped onto a pallet and wrapped with stretch film to prevent any shifting during transit.
We offer various shipping options to meet our customers' needs. Standard shipping is available for domestic and international orders, with estimated delivery times provided at the time of purchase. We also offer expedited shipping for urgent orders.
Our team carefully inspects each unit before packaging to ensure that it is in perfect working condition. We also include all necessary manuals and documentation with each shipment.
Please note that any additional fees or taxes associated with customs clearance are the responsibility of the customer.
Thank you for choosing our Semiconductor Molding Equipment. We are committed to providing a seamless and secure shipping experience for our customers.
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
