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Auto Chip Encapsulation System

Auto Plasticizing Press Semiconductor Manufacturing Equipment Large Capacity

ISO9001 Certified Trim Form IC Manufacturing Machines Manual Auto Operation

MOQ: 1 set

Model	TFM-1100
Forming Speed	Approx. 0.8 Seconds Per Piece
Weight	Approx. 500kg
Operation Mode	Manual/Auto
Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm

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Precision Cutting Semiconductor Trimming Forming Dies With High Speed Steel

MOQ: 1

Accuracy	Accurate Cutting And Forming
Finish	Polished
Material	High-speed Steel
Efficiency	High Production Efficiency
Durability	Long-lasting

60-65HRC Hardness Polished Trimming Forming Dies For Semicon Industry

Precision Cutting Semiconductor Trimming Forming Dies With High Speed Steel

Tendon Trim And Form Machine

High Accuracy Trim And Form Machine Tendon Cutting And Separation System

Automatically Trim And Form Machine Bar Cutting Forming Separating System

ISO9001 Certified Trim Form IC Manufacturing Machines Manual Auto Operation

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molding molds

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Auto Chip Encapsulation System

Auto Plasticizing Press Semiconductor Manufacturing Equipment Large Capacity

ISO9001 Certified Trim Form IC Manufacturing Machines Manual Auto Operation

Precision Cutting Semiconductor Trimming Forming Dies With High Speed Steel

60-65HRC Hardness Polished Trimming Forming Dies For Semicon Industry

Precision Cutting Semiconductor Trimming Forming Dies With High Speed Steel

Tendon Trim And Form Machine

High Accuracy Trim And Form Machine Tendon Cutting And Separation System

Automatically Trim And Form Machine Bar Cutting Forming Separating System

ISO9001 Certified Trim Form IC Manufacturing Machines Manual Auto Operation