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Keywords [ semicon molding equipment ] match 22 Products.

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

MOQ: 1 set

Air Pressure	0.5MPa
Air Consumption	Approx. 100L/min
Control System	PLC Control System
Dimensions	Approx. 1,200mm X 1,200mm X 1,500mm
Trimming Speed	Approx. 0.5 Seconds Per Piece

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

MOQ: 1

Compatibility	Suitable For Various Machines
Size	Customized
Precision	High
Application	Metal Trimming And Forming
Shape	Round

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

Lead Frame Semiconductor Molding

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Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Auto Frame Loader semicon equipment

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

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semicon molding equipment

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Semicon Production Trimming Forming Dies HRC 58-62 High Hardness

Rectangular Mirror Polished DIP4 MGP Mould For Semicon Processing

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

Lead Frame Semiconductor Molding

Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Auto Frame Loader semicon equipment

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

PLC Control Semicon Equipment IC Manufacturing Equipment 50/60Hz Power Supply