Cycle Time | Short |
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Safety Features | Advanced |
Material | Plastic |
Automation | Fully Automated |
Molding Method | Injection Molding |
Control System | PLC |
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Application | Semiconductor Industry |
Product Type | Molding Equipment |
Cycle Time | Short |
Automation | Fully Automated |
Capacity | 1000 Tons |
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Clamping Force | 1000 KN |
Control System | PLC |
Ejector Stroke | 300 Mm |
Injection Pressure | 200 MPa |
Control System | PLC |
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Dimensions | 1200mm X 800mm X 1500mm |
Forming Speed | 3000pcs/hour |
Max. Board Size | 400mm X 300mm |
Max. Board Thickness | 2mm |
Accuracy | ±0.01mm |
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Control System | PLC |
Dimensions | L 1000mm X W 500mm X H 800mm |
Forming Method | Mechanical |
Material | Stainless Steel |
Air Consumption | 100L/min |
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Air Pressure | 0.5-0.7MPa |
Control System | PLC + Touch Screen |
Dimensions | 1200mm X 800mm X 1500mm |
Forming Accuracy | ±0.02mm |
Application | IC Lead Frame Production |
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Material | Steel |
Mold Design | 3D CAD |
Mold Hardness | HRC 50-60 |
Mold Life | 500,000-1,000,000 Strokes |
Application | Manufacturing |
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Color | Silver |
Compatibility | Compatible With Various Machines |
Durability | High |
Maintenance | Low Maintenance Required |
Capacity | 1000 Units/hour |
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Control System | PLC |
Cooling System | Water Cooling |
Dimensions | 2000mm X 1500mm X 1800mm |
Heating Power | 10 KW |
Accuracy | High |
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Application | IC Lead Frame Production |
Cavity | Single |
Cooling System | Water Cooling |
Dimension | Customized |