| Cycle Time | Short |
|---|---|
| Safety Features | Advanced |
| Material | Plastic |
| Automation | Fully Automated |
| Molding Method | Injection Molding |
| Control System | PLC |
|---|---|
| Application | Semiconductor Industry |
| Product Type | Molding Equipment |
| Cycle Time | Short |
| Automation | Fully Automated |
| Capacity | 1000 Tons |
|---|---|
| Clamping Force | 1000 KN |
| Control System | PLC |
| Ejector Stroke | 300 Mm |
| Injection Pressure | 200 MPa |
| Control System | PLC |
|---|---|
| Dimensions | 1200mm X 800mm X 1500mm |
| Forming Speed | 3000pcs/hour |
| Max. Board Size | 400mm X 300mm |
| Max. Board Thickness | 2mm |
| Accuracy | ±0.01mm |
|---|---|
| Control System | PLC |
| Dimensions | L 1000mm X W 500mm X H 800mm |
| Forming Method | Mechanical |
| Material | Stainless Steel |
| Air Consumption | 100L/min |
|---|---|
| Air Pressure | 0.5-0.7MPa |
| Control System | PLC + Touch Screen |
| Dimensions | 1200mm X 800mm X 1500mm |
| Forming Accuracy | ±0.02mm |
| Application | IC Lead Frame Production |
|---|---|
| Material | Steel |
| Mold Design | 3D CAD |
| Mold Hardness | HRC 50-60 |
| Mold Life | 500,000-1,000,000 Strokes |
| Application | Manufacturing |
|---|---|
| Color | Silver |
| Compatibility | Compatible With Various Machines |
| Durability | High |
| Maintenance | Low Maintenance Required |
| Capacity | 1000 Units/hour |
|---|---|
| Control System | PLC |
| Cooling System | Water Cooling |
| Dimensions | 2000mm X 1500mm X 1800mm |
| Heating Power | 10 KW |
| Accuracy | High |
|---|---|
| Application | IC Lead Frame Production |
| Cavity | Single |
| Cooling System | Water Cooling |
| Dimension | Customized |