Control System | PLC |
---|---|
Cooling System | Water Cooling |
Dimensions | 2000x1500x2500 Mm |
Heating Power | 10 KW |
Injection Pressure | 200 MPa |
Capacity | 1000 Units/hour |
---|---|
Clamping Force | 200 Tons |
Control System | PLC |
Cooling System | Water |
Injection Pressure | 100 MPa |
Application | Semiconductor Manufacturing |
---|---|
Capacity | 1000 Tons |
Control System | PLC |
Frequency | 50Hz |
Injection Pressure | 200 MPa |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automated |
Capacity | High |
Control System | PLC |
Frequency | 50Hz/60Hz |
Capacity | 2000 Tons |
---|---|
Clamping Force | 2000 KN |
Control System | PLC |
Injection Pressure | 200 MPa |
Injection Speed | 300 Mm/s |
Capacity | 1000 Tons |
---|---|
Clamping Force | 1000 Tons |
Ejector Force | 200 Tons |
Injection Pressure | 2000 Bar |
Injection Unit | Single |
Application | Semiconductor Industry |
---|---|
Capacity | 1000 Tons |
Clamping Force | 5000 KN |
Control System | PLC |
Cooling Zones | 4 |
Application | Semiconductor Industry |
---|---|
Automation | Fully Automatic |
Capacity | 1000 Tons |
Control System | PLC |
Cooling System | Water Cooling |
Control System | PLC |
---|---|
Energy Consumption | Low |
Maintenance | Easy |
Molding Method | Injection Molding |
Precision | High |
Control System | PLC |
---|---|
Temperature Control | Precision Temperature Control |
Product Type | Molding Equipment |
Automation | Fully Automated |
Molding Method | Injection Molding |