Chip Molding Machine
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Brand Name: TJIN
Model Number: 001
Place of Origin: China
Certification: ISO9001
Minimum Order Quantity: 1
Packaging Details: Wooden Packaging
Delivery Time: 40 days
Payment Terms: TT
Technical Parameters | Value |
---|---|
Screw Diameter | 35 mm |
Model | SM-1000 |
Clamping Force | 1000 KN |
Platen Size | 600 x 600 mm |
Cooling System | Water |
Max. Mold Height | 400 mm |
Capacity | 100 tons |
Type | Vertical Injection Molding Machine |
Injection Pressure | 200 MPa |
Heating Power | 12 KW |
Product Features | Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).