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PLC Control IC Chip Molding Machine

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PLC Control IC Chip Molding Machine
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Features
Specifications
Capacity: 1000 Tons
Clamping Force: 1000 KN
Control System: PLC
Ejector Stroke: 300 Mm
Injection Pressure: 200 MPa
Injection Rate: 1000 Cm3/s
Injection Unit Stroke: 500 Mm
Max Mold Thickness: 1000 Mm
Model: SM-1000
Platen Size: 1500 X 1500 Mm
Power Supply: 3 Phase, 380V, 50Hz
Screw Diameter: 80 Mm
Type: Vertical
High Light:

PLC Control IC Chip Molding Machine

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PLC Control ic packaging equipment

Basic Infomation
Place of Origin: China
Brand Name: TJIN
Certification: ISO9001
Payment & Shipping Terms
Packaging Details: Wooden Packing
Delivery Time: 40 days
Product Description

Chip Molding Machine

 

Features

● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;

● Full servo control system, PLC (Omron) + controller;

● CCD image detection, feeding anti-reverse detection;

● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;

● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;

● Customized on demand, permanently provide quality service.

 

Customization:

TJIN Semiconductor Molding Machine - Customized Service

Brand Name: TJIN

Model Number: 001

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Product Attributes:
  • Auto Transfer Molding
  • Auto Packaging Equipment
  • Auto Packaging Equipment
  • Injection Unit: Single
  • Max. Mold Height: 400 Mm
  • Screw Diameter: 35 Mm
  • Cooling System: Water
  • Control System: PLC

Packing and Shipping:

Product Name: Semiconductor Molding Machine
Packaging and Shipping:
  • Each unit is packaged in a sturdy cardboard box to ensure safe transportation.
  • The packaging also includes foam inserts to protect the delicate components of the machine.
  • For international shipping, the machine will be packed in a wooden crate for extra protection.
  • The package will be labeled with the product name, model number, and any necessary handling instructions.
  • For domestic shipping, the machine will be shipped via a trusted courier service with tracking information provided.
  • International shipping will be arranged through a reputable freight forwarder to ensure timely and secure delivery.

 

Technical Parameters:

Technical Parameters Value
Screw Diameter 35 mm
Model SM-1000
Clamping Force 1000 KN
Platen Size 600 x 600 mm
Cooling System Water
Max. Mold Height 400 mm
Capacity 100 tons
Type Vertical Injection Molding Machine
Injection Pressure 200 MPa
Heating Power 12 KW
Product Features Auto Transfer Molding, Auto Packaging Equipment, Auto Transfer Molding, Semiconductor Packaging

 

Performance Parameters

● Mold closing pressure: 98-1764kN;

● Injection pressure: 4.9-30kN adjustable;

● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;

● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).

 

FAQ:

  • Q: What is the brand name of this product?
  • A: The brand name is TJIN.
  • Q: What is the model number of this product?
  • A: The model number is 001.
  • Q: Where is this product manufactured?
  • A: This product is manufactured in China.
  • Q: Does this product have any certifications?
  • A: Yes, it is certified with ISO9001.
  • Q: What is the minimum order quantity for this product?
  • A: The minimum order quantity is 1.
  • Q: How is this product packaged?
  • A: It is packaged in wooden packaging.
  • Q: What is the estimated delivery time for this product?
  • A: The estimated delivery time is 40 days.
  • Q: What are the accepted payment terms for this product?
  • A: The accepted payment terms are TT (telegraphic transfer).
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