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lead frame molding

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Phone Number : +86 13450030904
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Keywords [ lead frame molding ] match 50 products.
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Application Semiconductor Industry
Capacity 1000 Tons
Clamping Force 1000 KN
Control System PLC
Injection Speed 200 Mm/s
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MOQ: 1 set
Application Semiconductor Industry
Capacity 1000 Tons
Clamping Force 10000 KN
Control System PLC
Injection Pressure 200 MPa
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90KW Semiconductor Molding Equipment Semicon Transfer Molding Device

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Capacity 2000 Tons
Clamping Force 2000 KN
Control System PLC
Injection Pressure 200 MPa
Injection Speed 300 Mm/s
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Injection Molding MGP Mold

MOQ: 1 set
Application Injection Molding
Cavity Single Or Multi-cavity
Design Software UG, Pro/E, Solidworks, AutoCAD, Etc.
Lead Time 3-8 Weeks
Material High-quality Steel
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Application Injection Molding
Cavity Single/Multi
Color Silver
Ejection System Ejector Pin/Ejector Sleeve
Lead Time 4-8 Weeks
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High Productivity Semiconductor Packaging Equipment Chip Molding Device

MOQ: 1 set
Packaging Details Wooden Packing
Delivery Time 40 days
Place of Origin China
Brand Name TJIN
Certification ISO9001
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Auto Frame Loader semicon equipment

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Air Consumption 100L/min
Air Pressure 0.5-0.7MPa
Control System PLC
Dimensions 1200mm X 1200mm X 1500mm
Forming Speed 3000-4000pcs/hour
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MOQ: 1
Quality Control ISO9001:2015, SGS, ROHS
Mold Standard DME, HASCO, LKM Or Customized
Cooling System Water Cooling Or Air Cooling
Gate Type Edge Gate, Pin Point Gate, Sub Gate, Fan Gate, Etc.
Runner System Hot Runner Or Cold Runner
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Application Industrial
Color Silver
Compatibility Fits Most Casting Machines
Durability High
Material Aluminum
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Compatibility Universal
Compatibility With Different Materials Yes
Cost-effectiveness Affordable
Customization Options Extensive
Design Sleek
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+86 13450030904
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