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Phone Number :	+86 13450030904
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Keywords [ semiconductor molding machine ] match 107 products.

Ejection System Ejector Pin MGP Molding ROHS Mold Weight 50kg-10 Tons

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

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Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

MOQ: 1 set

Control System	PLC + HMI
Cooling System	Water Cooling
Forming Material	PVC, PET, PP, PS, Etc.
Forming Speed	10-20 Cycles/min
Heating System	Infrared Ceramic Heater

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

MOQ: 1

Mold Cooling System	Water Cooling
Tolerance	±0.01mm
Surface Treatment	Nickel Plating
Mold Material	NAK80, S136, SKD61, Etc.
Lead Time	4-6 Weeks

High Precision Semiconductors Trimming Forming Dies Cutting Mold Molding

Wear Resistance Customized Molding Molds In Semiconductor High Strength

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

Full Automatic Trim And Form Machine Cutting Forming Separating System 1.5KW

Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

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+86 13450030904

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semiconductor molding machine

Semiconductor Molding Machine

Trim And Form Machine

IC Lead Frame Stamping Mold

MGP Mold

Trimming Forming Dies

Mold Chase

Semiconductor Molding Equipment

Chip Sorting Machine

Ejection System Ejector Pin MGP Molding ROHS Mold Weight 50kg-10 Tons

Non Rusting Semicon Trimming Forming Dies Compatible With Various Machines

Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity

High Precision Semiconductors Trimming Forming Dies Cutting Mold Molding

Wear Resistance Customized Molding Molds In Semiconductor High Strength

Wear Resistant Semiconductor Trim And Form Dies With 60-65 HRC Hardness

Full Automatic Trim And Form Machine Cutting Forming Separating System 1.5KW

Water Cooling Semicon Equipment Semiconductor Cutting And Molding Device

Semiconductor Industry IC Lead Frame Stamping Mold With Single Cavity